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參數(shù)資料
| 型號： | WEDPS512K32-20BC |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PBGA143 |
| 封裝： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 235K |
| 代理商： | WEDPS512K32-20BC |
WEDPS512K32-XBX
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
November, 2003
Rev.6
WHITE ELECTRONIC DESIGNS CORP.
PLASTIC
SRAM
ORGANIZATION, 512Kx32
User congurable as 1Mx16 or 2Mx8
ACCESS TIME (ns)
PACKAGE TYPE:
B = 143 PBGA, 16mm x 18mm, 288mm2
DEVICE GRADE:
M = MILITARY SCREENED
-55°C TO +125°C
I
= INDUSTRIAL
-40°C TO 85°C
C = COMMERCIAL
0°C TO +70°C
ORDERING INFORMATION
WED P S 512K 32 - XX X X
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WEDPS512K32-20BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
| WEDPS512K32-20BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
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