參數(shù)資料
型號(hào)： WEDPNF8M721V-1215BI
元件分類： 存儲(chǔ)器
英文描述： SPECIALTY MEMORY CIRCUIT, PBGA275
封裝： 32 X 25 MM, PLASTIC, BGA-275
文件頁(yè)數(shù)： 1/42頁(yè)
文件大?。?/td> 686K
代理商： WEDPNF8M721V-1215BI
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
HI-RELIABILITY PRODUCT
WEDPNF8M721V-XBX
October 2000 Rev. 1
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module
Multi-Chip Package ADVANCED*
FEATURES
s Package:
275 Plastic Ball Grid Array (PBGA), 32mm x 25mm
s Commercial, Industrial and Military Temperature Ranges
s Weight:
WEDPNF8M721V-XBX - 2.5 grams typical
SDRAM PERFORMANCE FEATURES
s Organized as 8M x 72
s High Frequency = 100, 125MHz
s Single 3.3V
±0.3V power supply
s Fully Synchronous; all signals registered on positive edge of
system clock cycle
s Internal pipelined operation; column address can be changed
every clock cycle
s Internal banks for hiding row access/precharge
s Programmable Burst length 1,2,4,8 or full page
s 4096 refresh cycles
FLASH PERFORMANCE FEATURES
s User Configurable as 1Mx8 or 512Kx16
s Access Times of 100, 120, 150ns
32
25
Discrete Approach
S
A
V
I
N
G
S
Area
5 x 265mm + 54mm = 1379mm 2
2
800mm2
42%
5 x 54 pins + 48 balls = 318 connections
275 balls
14%
ACTUAL SIZE
22.3
11.9
I/O
Count
11.9
48
PBGA
6.0
9.0
Note: Dimensions in millimeters
s 3.3 Volt for Read and Write Operations
s 1,000,000 Erase/Program Cycles
s Sector Architecture
One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes
in byte mode
One 8K word, two 4K words, one 16K word, and fifteen 32K
word sectors in word mode.
Any combination of sectors can be concurrently erased. Also
supports full chip erase
s Boot Code Sector Architecture (Bottom)
s Embedded Erase and Program Algorithms
s Erase Suspend/Resume
Supports reading data from or programing data to a sector
not being erased
BENEFITS
s 42% SPACE SAVINGS
s Reduced part count
s Reduced I/O count
14% I/O Reduction
s Suitable for hi-reliability applications
s SDRAM Upgradeable to 16M x 72 density (contact factory for
information)
s Flash upgradeable to 2M x 8 (or 1M x 16 or 512K x 32) density
* This data sheet describes a product that may or may not be under
development and is subject to change or cancellation without notice.
相關(guān)PDF資料
PDF描述
WEDPNF8M721V-1212BM SPECIALTY MEMORY CIRCUIT, PBGA275
WEDPNF8M721V-1215BI SPECIALTY MEMORY CIRCUIT, PBGA275
WEDPNF8M721V-1012BM SPECIALTY MEMORY CIRCUIT, PBGA275
WEDPNF8M721V-1015BM SPECIALTY MEMORY CIRCUIT, PBGA275
WEDPNF8M721V-1010BC SPECIALTY MEMORY CIRCUIT, PBGA275
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
WEDPNF8M721V-1215BM 制造商:未知廠家 制造商全稱:未知廠家 功能描述:8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-XBX 制造商:未知廠家 制造商全稱:未知廠家 功能描述:8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1010BC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1010BI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1010BM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
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