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參數(shù)資料
| 型號： | WEDPDC3225-B |
| 英文描述： | Daisy Chain SDRAM MCP |
| 中文描述： | SDRAM的MCP的菊花鏈 |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 131K |
| 代理商： | WEDPDC3225-B |
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
February 2002 Rev. 1
25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm
Package material and assembly process
Ball pads diameter and ball attach process
Substrate dimensions, materal, process and thickness
(no vias)
Die dimensions and thickness (dummy die, no
wirebonds) 3 - State Outputs
all inear dimensions are n millimeters and parenthetically n nches
P
ACKAGE
D
IMENSION
:
This is a mechaincal daisy-chain test vehicle designed to
be representative of the 25 x 32mm, 25 x 25mm, 25 x 21mm,
and 21 x 21mm packages. Use is for second level intercon-
nection assembly test such tempature cycling, and conti-
nuity verification of the PBGA to the test board when it is
overflowed.
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| WEDPN16M64V-100B2C | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:16Mx64 Synchronous DRAM |
| WEDPN16M64V-100B2I | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:16Mx64 Synchronous DRAM |
| WEDPN16M64V-100B2M | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:16Mx64 Synchronous DRAM |
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| WEDPN16M64V-100BI | 制造商:Microsemi Corporation 功能描述:16M X 64 SDRAM MODULE, 3.3V, 100 MHZ, 219 PBGA 25MM X 25MM, - Bulk |
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