參數(shù)資料
型號(hào): WED3EG6418S335D4
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 16M X 64 DDR DRAM MODULE, DMA200
封裝: SODIMM-200
文件頁數(shù): 6/7頁
文件大?。?/td> 59K
代理商: WED3EG6418S335D4
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic
WED3EG6418S-D4
Oct. 2002
Rev. # 0
FINAL
White Electronic Designs Corp. reserves the right to change products or specications without notice.
IDD1 : OPERATING CURRENT: ONE
BANK
1. Typical Case : VCC = 2.5V, T = 25°C
2. Worst Case : VCC = 2.7V, T = 10°C
3. Only one bank is accessed with tRC (min), Burst Mode,
Address and Control inputs on NOP edge are changing
once per clock cycle.
IOUT = 0mA
4. Timing patterns
-DDR200 (100Mhz, CL = 2) : tCK = 10ns, CL2, BL = 4,
tRCD = 2*tCK, tRAS = 5*tCK
Read : A0 N R0 N N P0 N A0 N - repeat the same
timing with random address changing; 50% of data
changing at every burst
-DDR266B (133Mhz, CL = 2.5): tCK = 7.5ns, CL = 2.5,
BL = 4, tRCD = 3*tCK, tRC = 9*tCK, tRAS = 5*tCK
Read : A0 N N R0 N P0 N N N A0 N - repeat the
same timing with random address changing; 50% of
data changing at every burst
-DDR266A (133Mhz, CL = 2) : tCK = 7.5ns, CL = 2, BL
= 4, tRCD = 3*tCK, tRC = 9*tCK, tRAS = 5*tCK
Read : A0 N N R0 N P0 N N N A0 N - repeat the
same timing with random address changing; 50% of
data changing at every burst
-DDR333 (166MHz, CL = 2.5) : tCK = 6ns, CL = 2.5, BL
= 4, tRCD = 10*tCK, tRAS = 7*tCK
Read " A0 N N R0 N P0 N N N A0 N - repeat the same
timing with random address changing; 50% of data
changing at every burst.
IDD7A : OPERATING CURRENT : FOUR
BANK OPERATION
1. Typical Case : Vcc = 2.5V, T = 25°C
2. Worst Case : Vcc = 2.7V, T = 10°C
3. Four banks are being interleaved with tRC (min), Burst
Mode, Address and Control inputs on NOP edge are not
changing.
IOUT = 0mA
4. Timing patterns
- DDR200 (100Mhz, CL = 2) : tCK = 10ns, CL2, BL =
4, tRRD = 2*tCK, tRCD = 3*tCK, Read with autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 A0 R3 A1 R0 -
repeat the same timing with random address
changing; 100% of data changing at every burst
-DDR266B (133Mhz, CL = 2.5) : tCK = 7.5ns, CL =
2.5, BL = 4, tRRD = 2*tCK, tRCD = 3*tCK
Read with autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1
R0 - repeat the same timing with random address
changing; 100% of data changing at every burst
-DDR266A (133Mhz, CL = 2) : tCK = 7.5ns, CL2 = 2,
BL = 4, tRRD = 2*tCK, tRCD = 3*tCK
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1
R0 - repeat the same timing with random address
changing; 100% of data changing at every burst
-DDR333 (166MHz, CL = 2.5) : tCK = 6ns, CL =
2.5, BL = 4, tRRD = 2*tCK, tRCD = 3*tCK, Read with
autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1
R0 - repeat the same timing with random address
changing; 100% of data changing at every burst
Legend : A = Activate, R = Read, W = Write, P = Precharge, N = NOP
DETAILED TEST CONDITIONS FOR DDR SDRAM IDD1 & IDD7A
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