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參數(shù)資料
| 型號： | WE128K32-250G4QA |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | PROM |
| 英文描述： | 128K X 32 EEPROM 5V MODULE, 250 ns, CQMA68 |
| 封裝： | CERAMIC, QFP-68 |
| 文件頁數(shù)： | 6/15頁 |
| 文件大?。?/td> | 297K |
| 代理商： | WE128K32-250G4QA |
14
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WE128K32-XXX
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = Compliant
M = Military Screened
-55
°C to +125°C
I = Industrial
-40
°C to +85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400*)
G2T = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
G1U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519)
G4 = 40mm Ceramic Quad Flat Pack, CQFP (Package 501)
ACCESS TIME (ns)
IMPROVEMENT MARK
N = No Connect at pins 8, 21, 28, and 39 in HIP for upgrade
P = Alternate Pin Configuration for HIP package
ORGANIZATION 128K x 32
User Configurable as 256K x 16 or 512K x 8
EEPROM
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W E 128K32 X - XXX X X X
I/O0-31
Data Inputs/Outputs
A0-16
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
FIG. 12 ALTERNATE PIN CONFIGURATION FOR WE128K32NP-XH1X
PIN DESCRIPTION
BLOCK DIAGRAM
128K x 8
8
I/O 0-7
CS1
128K x 8
8
I/O 8-15
2
128K x 8
8
I/O 16-23
3
128K x 8
8
I/O 24-31
4
A 0-16
OE
WE
CS
WE
CS
WE
CS
WE
12
3
4
TOP VIEW
I/O8
I/O9
I/O10
A14
A16
A11
A0
NC
I/O0
I/O1
I/O2
WE2
CS2
GND
I/O11
A10
A9
A15
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
NC
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
NC
A13
A8
I/O16
I/O17
I/O18
VCC
CS4
WE4
I/O27
A4
A5
A6
WE3
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
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