
W78C354
- 44 -
40-pin DIP
Seating Plane
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 in.
are determined at the mold parting line.
4. Dimension B1 does not include dambar
6. General appearance spec. should be based on
final visual inspection spec.
1.372
1.219
0.054
0.048
Notes:
Symbol
Min.
Nom.
Max.
Max.
Nom.
Min.
Dimension In Inches
Dimension in mm
A
A
A
B
B
1
c
D
E
E
1
e
L
a
A
S
1
2
0.050
1.27
0.210
5.334
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.406
0.254
3.937
0.457
4.064
0.559
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.203
3.048
0.254
3.302
0.356
3.556
0.540
0.550
0.545
13.72
13.97
13.84
17.01
15.24
14.986
15.494
0.600
0.590
0.610
2.286
2.54
2.794
0.090
0.100
0.110
1
e
2.055
2.070
52.20
52.58
0
15
0.090
2.286
0.650
0.630
16.00
16.51
protrusion/intrusion.
5. Controlling dimension: Inches.
15
0
e
A
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
40
21
20
1
2
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792697
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Note: All data and specifications are subject to change without notice.