參數(shù)資料
型號: W78C378P
廠商: WINBOND ELECTRONICS CORP
元件分類: 微控制器/微處理器
英文描述: MONITOR MICROCONTROLLER
中文描述: 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQCC44
封裝: PLASTIC, LCC-44
文件頁數(shù): 37/38頁
文件大小: 396K
代理商: W78C378P
Preliminary W78E378/W78C378/W78C374
Publication Release Date: December 1999
- 37 - Revision A1
PACKAGE DIMENSIONS
32-pin P-DIP
1. tie bar burrs.
2. are determined at the mold parting line.
4. protrusion/intrusion.
final visual inspection spec.
1.37
1.22
0.054
0.048
Notes:
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in inches
Dimension in mm
A
A
A
B
B
1
c
D
E
E
1
e
L
a
A
S
1
2
0.050
1.27
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.555
0.550
0.545
14.10
13.97
13.84
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
1
e
1.650
1.660
41.91
42.16
0
15
0.085
2.16
0.650
0.630
16.00
16.51
6. General appearance spec. should be based on
15
0
Seating Plane
e
A
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
32
1
16
17
40-pin DIP
Seating Plane
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include.
are determined at the mold parting line.
4. Dimension B1 does not include dambar
6. General appearance spec. should be based on
final visual inspection spec.
1.372
1.219
0.054
0.048
Notes:
Symbol
Min. Nom.
Max.
Max.
Nom.
Min.
Dimension in inch
Dimension in mm
0.050
1.27
0.210
5.334
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.406
0.254
3.937
0.457
4.064
0.559
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.203
3.048
0.254
3.302
0.356
3.556
0.540
0.550
0.545
13.72
13.97
13.84
17.01
15.24
14.986
15.494
0.600
0.590
0.610
2.286
2.54
2.794
0.090
0.100
0.110
A
A
A
B
B
1
c
D
E
E
1
e
L
a
A
S
1
2
1
e
2.055
2.070
52.20
52.58
0
15
0.090
2.286
0.650
0.630
16.00
16.51
protrusion/intrusion.
5. Controlling dimension: Inches.
15
0
e
A
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
40
21
20
1
2
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