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參數資料
| 型號： | W72M64V-100BI |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | PROM |
| 英文描述： | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| 封裝： | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| 文件頁數： | 6/15頁 |
| 文件大小： | 160K |
| 代理商： | W72M64V-100BI |
14
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
W72M64V-XBX
W 7 2M64 V XXX B X
ORDERING INFORMATION
PACKAGE: 159 PBGA
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES.
BOTTOM VIEW
13.1 (0.516) MAX
11.43 (0.450) NOM
1.27 (0.050) NOM
1.27
(0.050)
NOM
19.05
(0.750)
NOM
22.1
(0.870)
MAX
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
10
9
8
7
6
5
4
3
2
1
159 Y
0.762 (0.030) NOM
2.03 (0.080) MAX
0.61 (0.024)
NOM
WHITE ELECTRONIC DESIGNS CORP.
Flash
ORGANIZATION, 2M x 64
User configurable as 2 x 2M x 32
3.3V Power supply
ACCESS TIME (ns)
100 = 100ns
120 = 120ns
150 = 150ns
PACKAGETYPE:
B = 159 Plastic BGA, 13mm x 22mm
DEVICE GRADE:
M = Military Screened
-55°C to +125°C
I
= Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
相關PDF資料 |
PDF描述 |
|---|---|
| W72M64VK100BI | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| W78M64110SBM | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64110SBI | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64120SBI | 8M X 64 FLASH 3.3V PROM, 120 ns, PBGA159 |
| W78M64110SBC | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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