參數資料
型號: W671571Y
廠商: WINBOND ELECTRONICS CORP
元件分類: 模擬傳輸電路
英文描述: TELECOM-SLIC, QCC32
封裝: 7 X 7 MM, 0.65 MM PITCH, QFN-32
文件頁數: 35/42頁
文件大小: 1230K
代理商: W671571Y
W671500 SERIES
12.2.1. Special Considerations for the QFN Package
The QFN package offers a significant footprint reduction (65%) and improved thermal performance
with respect to the 28 lead PLCC. To realize the thermal enhancements and maintain the high voltage
(-100V) performance the exposed leadframe should be soldered to a power/heat sink plane that is
electrically connected to the high battery supply (VBH) within the application board. This approach
distributes the heat evenly across the board and is accomplished by using conductive thermal
- 40 -
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