參數(shù)資料
型號: W671371P
廠商: WINBOND ELECTRONICS CORP
元件分類: 模擬傳輸電路
英文描述: TELECOM-SLIC, PQCC28
封裝: PLASTIC, LCC-28
文件頁數(shù): 41/48頁
文件大?。?/td> 1344K
代理商: W671371P
W671300 SERIES
12.2.1. Special Considerations for the QFN Package
The Quad Flatpack No-lead (QFN) package offers a significant footprint reduction (65%) and
improved thermal performance with respect to the 28 lead PLCC. To realize the thermal
enhancements and maintain the high voltage (-100V) performance, the exposed pad on the bottom of
the QFN package should be soldered to a power/heat sink plane that is electrically connected to
Substrate Common Connection (SCC) pin. The heat is distributed evenly across the board by way of
the heat sink plane. This is accomplished by using conductive thermal vias.
- 46 -
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