參數(shù)資料
型號: W523A015
廠商: WINBOND ELECTRONICS CORP
元件分類: 音頻合成
英文描述: DIODE ZENER SINGLE 200mW 36Vz 3.4mA-Izt 0.05 0.1uA-Ir 27 SOD-323 3K/REEL
中文描述: 15 SEC, SPEECH SYNTHESIZER, UUC29
封裝: DIE-29
文件頁數(shù): 1/19頁
文件大?。?/td> 775K
代理商: W523A015
W523AXXX
HIGH FIDELITY
PowerSpeech
TM
Publication Release Date: May 20, 2003
- 1 -
Revision A3
Table of Contents-
1.
GENERAL DESCRIPTION ......................................................................................................... 2
2.
FEATURES................................................................................................................................. 2
3.
BLOCK DIAGRAM...................................................................................................................... 3
4.
PIN DESCRIPTION..................................................................................................................... 4
5.
FUNCTIONAL DESCRIPTION.................................................................................................... 5
5.1
Register Definition and Control........................................................................................ 5
5.2
Option Control Function................................................................................................... 8
5.3
Interrupt Vector Allocation............................................................................................... 8
5.4
CPU Interface................................................................................................................ 10
6.
ELECTRICAL CHARACTERISTICS......................................................................................... 13
6.1
Absolute Maximum Ratings........................................................................................... 13
6.2
DC Characteristics......................................................................................................... 13
6.3
AC Characteristics......................................................................................................... 14
7.
BONDING PAD DIAGRAM....................................................................................................... 15
8.
TYPICAL APPLICATION CIRCUIT........................................................................................... 17
8.1
DAC Output ................................................................................................................... 17
8.2
PWM Output.................................................................................................................. 18
9.
REVISION HISTORY................................................................................................................ 19
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