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參數(shù)資料
| 型號(hào)： | W3HG2128M64EEU665D4ISG |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 256M X 64 DDR DRAM MODULE, 0.45 ns, DMA200 |
| 封裝： | ROHS COMPLIANT, SO-DIMM-200 |
| 文件頁(yè)數(shù)： | 8/11頁(yè) |
| 文件大?。?/td> | 174K |
| 代理商： | W3HG2128M64EEU665D4ISG |
W3HG2128M64EEU-D4
June 2007
Rev. 5
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
DDR2 ICC SPECIFICATION
Symbol Proposed Conditions
805
806
665
534
403
Units
ICC0*
Operating one bank active-precharge;
tCK = tCK(ICC), tRC = tRC(ICC), tRAS = tRAS min(ICC); CKE is HIGH, CS# is HIGH between valid
commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING
840
800
760
720
mA
ICC1*
Operating one bank active-read-precharge;
IOUT = 0mA; BL = 4, CL = CL(ICC), AL = 0; tCK = tCK(ICC), tRC = tRC (ICC), tRAS = tRAS min(ICC); CKE
is HIGH, CS# is HIGH between valid commands; Address bus inputs are SWITCHING; Data
pattern is same as ICC4W
920
880
840
800
mA
ICC2P**
Precharge power-down current;
All banks idle; tCK = tCK(ICC); CKE is LOW; Other control and address bus inputs are STABLE;
Data bus inputs are FLOATING
240
mA
ICC2Q**
Precharge quiet standby current;
All banks idle; tCK = tCK(ICC); CKE is HIGH, CS# is HIGH; Other control and address bus inputs
are STABLE; Data bus inputs are FLOATING
640
560
mA
ICC2N**
Precharge standby current;
All banks idle; tCK = tCK(ICC); CKE is HIGH, CS# is HIGH; Other control and address bus inputs
are STABLE; Data bus inputs are SWITCHING
800
720
640
mA
ICC3P**
Active power-down current;
All banks open; tCK = tCK(ICC); CKE is LOW; Other control and
address bus inputs are STABLE; Data bus inputs are FLOATING
Fast PDN Exit MRS(12) = 0
640
560
mA
Slow PDN Exit MRS(12) = 1
288
mA
ICC3N**
Active standby current;
All banks open; tCK = tCK(ICC), tRC = tRC(ICC, tRAS = tRAS min(ICC); CKE is HIGH, CS# is HIGH
between valid commands; Other control and address bus inputs are SWITCHING; Data bus
inputs are SWITCHING
1,040 1,040
960
880
mA
ICC4W*
Operating burst write current;
All banks open, Continuous burst writes; BL = 4, CL = CL(ICC), AL = 0; tCK = tCK(ICC), tRAS =
tRASmax(ICC), tRP = tRP(ICC); CKE is HIGH, CS# is HIGH between valid commands; Address bus
inputs are SWITCHING; Data bus inputs are SWITCHING
1,280 1,280 1,160 1,080
960
mA
ICC4R*
Operating burst read current;
All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(ICC), AL = 0; tCK = tCK(ICC),
tRAS = tRASmax(ICC), tRP = tRP(ICC); CKE is HIGH, CS# is HIGH between valid commands;
Address bus inputs are SWITCHING; Data pattern is same as ICC4W
1,360 1,360 1,240 1,160 1,040
mA
ICC5*
Burst auto refresh current;
tCK = tCK(ICC); Refresh command at every tRFC(ICC) interval; CKE is HIGH, CS# is HIGH between
valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are
SWITCHING
2,480 2,480 2,400 2,400 2,320
mA
ICC6**
Self refresh current;
CK and CK# at 0V; CKE 0.2V; Other control and address bus
inputs are FLOATING; Data bus inputs are FLOATING
Normal
240
mA
ICC7*
Operating bank interleave read current;
All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(ICC), AL = tRCD(ICC)-1*tCK(ICC); tCK =
tCK(ICC), tRC = tRC(ICC), tRRD = tRRD(ICC), tRCD = 1*tCK(ICC); CKE is HIGH, CS# is HIGH between
valid commands; Address bus inputs are STABLE during DESELECTs; Data bus inputs are
SWITCHING.
2,240 2,200 2,040 2,040 1,920
mA
ICC specication is based on
SAMSUNG components. Other DRAM manufactures specication may be different.
Note:
* Value calculated as one module rank in this operating condition, and all other module ranks in ICC2P (CKE LOW) mode.
** Value calculated reects all module ranks in this operating condition.
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