參數(shù)資料
型號(hào): W29C040T-15C
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 512K X 8 FLASH 5V PROM, 150 ns, PDSO40
封裝: TSOP1-40
文件頁數(shù): 13/22頁
文件大?。?/td> 134K
代理商: W29C040T-15C
Preliminary W29C040
- 20 -
PACKAGE DIMENSIONS
32-pin P-DIP
1. Dimensions D Max. & S include mold flash or tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and are
determined at the mold parting line.
6. General appearance spec. should be based on final visual
inspection spec.
1.37
1.22
0.054
0.048
Notes:
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in inches
Dimension in mm
A
B
c
D
e
A
L
S
A
1
2
E
0.050
1.27
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.555
0.550
0.545
14.10
13.97
13.84
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
B1
1
e
E 1
a
1.650
1.660
41.91
42.16
0
15
0.085
2.16
0.650
0.630
16.00
16.51
4. Dimension B1 does not include dambar protrusion/intrusion.
5. Controlling dimension: Inches.
15
0
Seating Plane
eA
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
32
1
16
17
32-pin SO Wide Body
1
17
32
16
y
e
D
S
Seating Plane
b
A
E H
L
E
1
c
e
1
e
A 2
See Detail F
Detail F
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimensions D & E include mold mismatch
and determined at the mold parting line.
.
Notes:
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
0.20
0.15
0.008
0.006
Symbol
Min.
Nom.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
b
c
D
e
HE
L
y
A
L E
1
2
E
0.012
0.31
0.118
3.00
0.004
0.101
0.014
0.106
0.016
0.111
0.020
2.57
0.36
0.10
2.69
0.41
2.82
0.51
0.047
0.004
0
10
0.805
0.055
0.817
0.063
1.19
20.45
1.40
20.75
1.60
0.556
0.546
14.38
14.12
13.87
10
0
0.10
11.43
11.30
11.18
0.450
0.445
0.440
0.58
0.79
0.99
0.023
0.031
0.039
1.12
1.27
1.42
0.044
0.050
0.056
S
0.91
0.036
θ
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