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參數(shù)資料
| 型號： | W-30 |
| 元件分類： | 保險(xiǎn)絲 |
| 英文描述： | Fuse |
| 中文描述： | 保險(xiǎn)絲 |
| 文件頁數(shù)： | 18/18頁 |
| 文件大?。?/td> | 211K |
| 代理商： | W-30 |
Preliminary W81181D/AD
- 18 -
10. PACKAGE DIMENSIONS
48-pin QFP
2
1
A
H
D
D
e
b
E
H
E
y
A
A
Seating Plane
L
L
1
See Detail F
Detail F
c
37
48
1
12
13
24
25
36
1. Dimensions D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.
Notes:
Symbol
Min.
Nom.
Max.
Max.
Nom.
Min.
Dimension in Inch
Dimension in mm
A
A
A
b
c
D
E
e
H
D
H
E
L
L
1
y
θ
1
2
1.40
0.20
0.50
1.00
7.00
9.00
9.00
7.00
---
---
---
1.60
0.15
1.45
1.35
0.05
0.17
0.27
---
0.09
0.20
0.45
0.60
0.75
0.08
0
3.5
7
---
---
θ
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792646
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Note: All data and specifications are subject to change without notice.
Please note that all data and specifications are subject to change without notice. All the trade marks of products
and companies mentioned in this data sheet belong to their respective owners.
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