參數(shù)資料
型號(hào)： VSMP1206
廠商： Vishay Intertechnology,Inc.
英文描述： Z-Based Bulk Metal Foil Technology Discrete High Precision Surface Mount Chip Resistor High Power - Excellent Long Term Stabilty
中文描述： 的Z -基大塊金屬箔技術(shù)離散高精度表面貼裝芯片電阻，高功率-卓越的長(zhǎng)期穩(wěn)固
文件頁(yè)數(shù)： 2/2頁(yè)
文件大小： 84K
代理商： VSMP1206
For technical questions in the Americas, contact foilsupport1@vishay.com
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
www.vishay.com
25
VSMP1206
Vishay Foil Resistors
Document Number: 63096
Revision 28-Oct-04
S
ISRAEL: foilsales.israel@vishay.com FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com AMERICAS: foilsales.usa@vishay.com
ASIA/JAPAN: foilsales.asia@vishay.com UK/HOLLAND/SCANDINAVIA: foilsales.eunorth@vishay.com GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
SALES
MODEL
CHIP SIZE
RESISTANCE VALUE
TOLERANCE
TERMINATION
PACKAGING
VSMP
1206
RESISTANCE
RANGE
LETTER
DESIGNATOR
MULTIPLIER
FACTOR
T
±
0.01%
Q
±
0.02%
A
±
0.05%
B
±
0.1%
C
±
0.25%
D
±
0.5%
F
±
1.0%
S
- Lead (Pb)-free
B
- Tin/Lead
T =
Tape and
Reel
W = Waffle
Pack
10
to < 1K
R
x 1.0
Example: 249R00 = 249
1K to 30K
K
x 10
3
Example: 10K000 = 10.0K
TABLE 4 - ORDERING INFORMATION
TABLE 3 - DIMENSIONS AND LAND PATTERN
in inches (millimeters)
Z-Based Bulk Metal
Foil Technology
Discrete High Precision Surface Mount Chip Resistor
*Land Pattern Dimensions are per IPC-782
L
W
T
D
Z*
G*
X*
±
0.005 [0.13]
±
0.005 [0.13]
MAXIMUM
±
0.005 [0.13]
MAXIMUM
MINIMUM
MAXIMUM
0.126
[3.2]
0.062
[1.57]
0.025
[0.64]
0.020
[0.50]
0.175
[4.4]
0.059
[1.5]
0.071
[1.806]
*As shown + 0.01 Ohms to allow for measurement errors at low values.
FIGURE 2 - DERATING CURVE
125
100
75
50
25
0
-75
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (
°
C)
P
–55
°
C
+70
°
C
Rated Power
25% to 85% of T
A low profile solder fillet is
recommended to avoid unnecessary
stresses along top edge of
metallization. IR and vapor phase
reflow are best. Avoid the use of
cleaning agents which could attack
epoxy resins, which form part of the
resistor construction.
FIGURE 3 - RECOMMENDED MOUNTING
TEST
MIL-PRF-55342G
CHARACTERISTIC E
R LIMITS
VSMP1206
MAXIMUM
R LIMITS*
Thermal Shock
±
0.10%
±
0.01%
Low Temperature Operation
±
0.10%
±
0.01%
Short Time Overload
±
0.10%
±
0.01%
High Temperature Exposure
±
0.10%
±
0.02%
Resistance to Bonding
±
0.20%
±
0.01%
Moisture Resistance
±
0.20%
±
0.02%
Life 2000 hours @ + 70
°
C
±
0.50%
±
0.01%
Power @ + 70
°
C (mW)
300
-
Maximum Working Voltage
(P x R)
1/2
-
TABLE 2 -ENVIRONMENTAL PERFORMANCE
SPECIFICATIONS
T
W
L
G
Z
X
D
Top View
Recommended Land Pattern
*Example: VSMP1206 10K000 TSW, VSMP1206, Value: 10K, Tolerance: 0.01%, Lead (Pb)-free, Waffle Pack.
Footprint
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