參數(shù)資料
型號(hào): VSMG2720-GS08
廠商: VISHAY SEMICONDUCTORS
元件分類: 光電檢測(cè)器
英文描述: Infrared LED, 2.4 mm, 1 ELEMENT, INFRARED LED, 830 nm, GREEN, PLASTIC, SMD, LCC-2
中文描述: Infrared Emitters High Speed Emitter 5V 160mW 830nm 60Deg
文件頁數(shù): 4/6頁
文件大小: 132K
代理商: VSMG2720-GS08
www.vishay.com
4
For technical questions, contact:
emittertechsupport@vishay.com
Document Number: 81597
Rev. 1.2, 03-Nov-09
VSMG2720
Vishay Semiconductors
High Speed Infrared Emitting Diode,
830 nm, GaAlAs Double Hetero
PACKAGE DIMENSIONS
in millimeters
SOLDER PROFILE
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 for
Preconditioning acc. to JEDEC, Level 3
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T
amb
< 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
20541
Mounting Pad Layout
1.2
2
1.6 (1.9)
4
4
area covered with
solder resist
3.5
± 0.2
3
+ 0.15
1
±
0
2
±
C
A
Pin identification
2
2.4
technical drawings
according to DIN
specifications
Drawing-No.: 6.541-5067.01-4
Issue: 5; 04.11.08
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Time (s)
T
240 °C
217 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19841
255 °C
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