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  • 參數(shù)資料
    型號: VSKL71/06
    廠商: VISHAY INTERTECHNOLOGY INC
    元件分類: 晶閘管
    英文描述: 117.75 A, 600 V, SCR, TO-240AA
    封裝: ROHS COMPLIANT, TO-240AA COMPATIBLE, ADD-A-PAK-5
    文件頁數(shù): 3/8頁
    文件大?。?/td> 413K
    代理商: VSKL71/06
    Document Number: 94631
    For technical questions, contact: indmodules@vishay.com
    www.vishay.com
    Revision: 05-Aug-09
    3
    VSK.71.. Series
    ADD-A-PAK Generation VII Power Modules
    Thyristor/Diode and Thyristor/Thyristor, 75 A
    Vishay High Power Products
    Note
    Table shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC
    TRIGGERING
    PARAMETER
    SYMBOL
    TEST CONDITIONS
    VALUES
    UNITS
    Maximum peak gate power
    PGM
    12
    W
    Maximum average gate power
    PG(AV)
    3.0
    Maximum peak gate current
    IGM
    3.0
    A
    Maximum peak negative gate voltage
    - VGM
    10
    V
    Maximum gate voltage required to trigger
    VGT
    TJ = - 40 °C
    Anode supply = 6 V
    resistive load
    4.0
    TJ = 25 °C
    2.5
    TJ = 125 °C
    1.7
    Maximum gate current required to trigger
    IGT
    TJ = - 40 °C
    Anode supply = 6 V
    resistive load
    270
    mA
    TJ = 25 °C
    150
    TJ = 125 °C
    80
    Maximum gate voltage that will not trigger
    VGD
    TJ = 125 °C, rated VDRM applied
    0.25
    V
    Maximum gate current that will not trigger
    IGD
    TJ = 125 °C, rated VDRM applied
    6
    mA
    BLOCKING
    PARAMETER
    SYMBOL
    TEST CONDITIONS
    VALUES
    UNITS
    Maximum peak reverse and off-state
    leakage current at VRRM, VDRM
    IRRM,
    IDRM
    TJ = 125 °C, gate open circuit
    15
    mA
    Maximum RMS insulation voltage
    VINS
    50 Hz
    3000 (1 min)
    3600 (1 s)
    V
    Maximum critical rate of rise of off-state voltage
    dV/dt
    TJ = 125 °C, linear to 0.67 VDRM
    1000
    V/s
    THERMAL AND MECHANICAL SPECIFICATIONS
    PARAMETER
    SYMBOL
    TEST CONDITIONS
    VALUES
    UNITS
    Junction operating and storage
    temperature range
    TJ, TStg
    - 40 to 125
    °C
    Maximum internal thermal resistance,
    junction to case per leg
    RthJC
    DC operation
    0.29
    °C/W
    Typical thermal resistance,
    case to heatsink per module
    RthCS
    Mounting surface flat, smooth and greased
    0.1
    Mounting torque ± 10 %
    to heatsink
    A mounting compound is recommended and the
    torque should be rechecked after a period of
    3 h to allow for the spread of the compound.
    4
    Nm
    busbar
    3
    Approximate weight
    75
    g
    2.7
    oz.
    Case style
    JEDEC
    TO-240AA compatible
    ΔR CONDUCTION PER JUNCTION
    DEVICES
    SINE HALF WAVE CONDUCTION
    RECTANGULAR WAVE CONDUCTION
    UNITS
    180°
    120°
    90°
    60°
    30°
    180°
    120°
    90°
    60°
    30°
    VSK.71..
    0.052
    0.062
    0.079
    0.116
    0.197
    0.037
    0.064
    0.085
    0.121
    0.200
    °C/W
    相關(guān)PDF資料
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