參數(shù)資料
型號: VSC7140
廠商: Vitesse Semiconductor Corporation.
英文描述: 1.0625 Gb/s Fibre Channel Dual Repeater / Hub Node
中文描述: 1.0625 Gb / s光纖通道雙中繼器/集線器節(jié)點(diǎn)
文件頁數(shù): 11/12頁
文件大?。?/td> 115K
代理商: VSC7140
VITESSE
Data Sheet
VSC7140
1.0625 Gb/s Fibre Channel
Dual Repeater / Hub Node
G52180-0, Rev 4.0
10/23/00
Page 11
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano Camarillo, CA 93012
Tel: (800) VITESSE FAX: (805) 987-5896 Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Package Thermal Characteristics
The VSC7140 is packaged into a thermally-enhanced plastic quad flatpack. This package adheres to the
industry-standard EIAJ footprint for a 10x10mm body but has been enhanced to improve thermal dissipation
with the inclusion of an exposed copper heat spreader. The package construction is as shown in Figure 6.
Figure 6: Package Cross Section
The thermal resistance for the VSC7140 package is improved through low thermal resistance paths from
the die to the exposed surface of the heat spreader and from the die to the leadframe through the heat spreader
overlap of the leadframe.
Table 3: 52 PQFP Thermal Resistance
The user must ensure that the maximum case temperature specification (95
o
C) is not exceeded. Given the
thermal resistance of the package in still air, the user may operate the VSC7140 in still air if the ambient tem-
perature does not exceed 32
o
C (95
o
C - 1.7W * 37
o
C/W = 32
o
C). If operation above this ambient temperature
is required, an appropriate heatsink must be used with the part or adequate airflow must be provided.
Moisture Sensitivity Level
This device is rated with a moisture sensitivity level 3 rating. Refer to Application Note AN-20 for appro-
priate handling procedures.
Symbol
Description
Value
Units
θ
jc
θ
ca
Thermal resistance from junction to case
2.5
o
C/W
Thermal resistance from case to ambient in still air including conduction through
the leads for a non-thermally saturated board.
37.0
o
C/W
θ
ca-100
θ
ca-200
θ
ca-400
θ
ca-600
Thermal resistance from case to ambient in 100 LFPM air.
31.0
o
C/W
Thermal resistance from case to ambient in 200 LFPM air.
28.0
o
C/W
Thermal resistance from case to ambient in 400 LFPM air.
24.0
o
C/W
Thermal resistance from case to ambient in 600 LFPM air.
22.0
o
C/W
Lead
Copper Heat Spreader
Die
Plastic Molding Compound
Insulator
Wire Bond
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