參數(shù)資料
型號(hào): VNC2-64L1B-REEL
廠商: FTDI, Future Technology Devices International Ltd
文件頁(yè)數(shù): 80/88頁(yè)
文件大?。?/td> 0K
描述: IC USB HOST/DEVICE CTRL 64-LQFP
應(yīng)用說(shuō)明: Vinculum-II IO Cell Description AppNote
Vinculum-II Debug Interface Description AppNote
Vinculum-II IO Mux Explained AppNote
Vinculum-II PWM Example AppNote
Migrating Vinculum Designs AppNote
特色產(chǎn)品: Vinculum VNC2
標(biāo)準(zhǔn)包裝: 1
系列: Vinculum-II
控制器類(lèi)型: USB 2.0 控制器
接口: USB,主機(jī)/設(shè)備配置,UART,SPI,PWM,閃存 256K,DMA 4CH
電源電壓: 1.62 V ~ 1.98 V
電流 - 電源: 25mA
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 64-LQFP
供應(yīng)商設(shè)備封裝: 64-LQFP(10x10)
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 634 (CN2011-ZH PDF)
其它名稱(chēng): 768-1047-6
81
Copyright 2009-2011 Future Technology Devices International Limited
Datasheet
Vinculum-II Embedded Dual USB Host Controller IC
Version 1.5
Document No.: FT_000138 Clearance No.: FTDI# 143
Profile Feature
Pb Free Solder Process
(green material)
SnPb Eutectic and Pb free (non
green material) Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat:
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
Time within 5°C of actual Peak
Temperature (tp)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
Time for T= 25°C to Peak Temperature, Tp
8 minutes Max.
6 minutes Max.
Table 11.1 Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0 °C
220 +5/-0 °C
≥ 2.5 mm
220 +5/-0 °C
Pb Free (green material) = 260 +5/-0 °C
Table 11.2 Package Reflow Peak Temperature
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VNC2-64L1B-TRAY 功能描述:USB 接口集成電路 Vinculum-II Dual Host/Dev IC LQFP-64 RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
VNC2-64L1C-REEL 功能描述:IC USB HOST/DEVICE CTRL 64-LQFP 制造商:ftdi, future technology devices international ltd 系列:Vinculum-II 包裝:剪切帶(CT) 零件狀態(tài):停產(chǎn) 協(xié)議:USB 功能:控制器 接口:SPI,UART 標(biāo)準(zhǔn):USB 2.0 電壓 - 電源:1.62 V ~ 1.98 V 電流 - 電源:25mA 工作溫度:-40°C ~ 85°C 封裝/外殼:64-LQFP 供應(yīng)商器件封裝:64-LQFP(10x10) 標(biāo)準(zhǔn)包裝:1
VNC2-64Q1A-REEL 功能描述:USB 接口集成電路 Obsolete see VNC2-64Q1B-REEL RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
VNC2-64Q1A-TRAY 功能描述:USB 接口集成電路 Obsolete see VNC2-64Q1B-TRAY RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類(lèi)型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
VNC2-64Q1B 制造商:Future Technology Devices International (FTDI Chip) 功能描述:CONTROLLER USB VINCULUM II 64QFN 制造商:Future Technology Devices International (FTDI Chip) 功能描述:CONTROLLER, USB, VINCULUM II, 64QFN 制造商:Future Technology Devices International (FTDI Chip) 功能描述:Programmable USB 2.0 Host IC,64pin QFN