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參數(shù)資料
| 型號(hào)： | VJ5601M915MXBSR |
| 廠商： | Vishay Vitramon |
| 文件頁數(shù)： | 4/5頁 |
| 文件大小： | 201K |
| 描述： | RF ANTENNA |
| 特色產(chǎn)品： | VJ5601M915 Series |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 天線類型： | 芯片 |
| 頻帶數(shù)目： | 1 |
| 頻率： | 915MHz 中心 |
| 增益： | 1.73dBi |
| 端子： | 表面貼裝型 |
| 安裝類型： | 表面貼裝 |
| 高度（最大）： | 0.04"（1.2mm） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | 720-1276-6 |
VJ5601M915MXBSR
www.vishay.com
Vishay Vitramon
Revision: 28-Mar-12
4
Document Number: 45208
For technical questions, contact: chipantenna@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VJ5601M915 ASSEMBLY GUIDELINES
1. Mounting of antennas on a printed circuit board should
be done by reflow soldering using the profiles shown
(Figures 8, 9, and 10)
2. In order to provide the adequate strength between the
antenna and the PCB apply of a dot of heat cured epoxy
glue in the center of the footprint of the antenna prior to
soldering the antenna to the board. An example for such
glue is Heraeus PD 860002 SA. The weight of the dot
should be 5 mg to 10 mg.
Fig. 10 - Soldering IR Reflow with SnAgCu Solder
Note
(1)
The VJ5601M915 kit is available for evaluation. For samples, please contact mlcc-samples@vishay.com
.
0
50
100
150
200
250
300
T
C)
Time
60 s to 120 s
30 s to 60 s
Max. temperature
Min. temperature
Sn-Ag-Cu solder paste
60 s to 120 s
60 s to 120 s
ORDERING INFORMATION
VISHAY MATERIAL
PACKAGING QUANTITY
VJ5601M915 Chip Antenna
VJ5601M915MXBSR
1000 pieces
VJ5601M915 Evaluation Kit
(1)
VJ5601M915MXBEK
1 kit
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