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參數(shù)資料
| 型號(hào)： | VFC1206RTBW |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | High Precision Flip Chip, Patents Pending (Industrialized Countries) |
| 中文描述： | 高精度覆晶，即將獲得專利（工業(yè)化國(guó)家） |
| 文件頁(yè)數(shù)： | 2/2頁(yè) |
| 文件大小： | 127K |
| 代理商： | VFC1206RTBW |
Document Number: 63084
Revision 03-Jul-02
www.vishay.com
N2
VFC1206
Vishay Foil Resistors
VISHAY FOIL FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31
GERMANY +49.9287.710 FAX: +49 9287.70435
ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
ITALY + 39.2.300.11919 FAX: +39.2.300.11999
JAPAN +81.42.729.0661 FAX: +81.42.729.3400
SINGAPORE +65.788.6668 FAX: +65.788.0988
SWEDEN +46.8.594.70590 FAX: +46.8.594.70581
UK +44 191 514 8237 FAX: +44 1953 457 722
USA +1 610 407-4800 FAX: +1 610 640-9081
L
W
D
Solder Terminal (2)
High Purity Alumina
Substrate
Resistive
Bulk Metal
Foil
Solder
Protective
Coating
FIGURE 3 - CHIP CONFIGURATION
MODEL
CHIP SIZE
RESISTANCE VALUE
TOLERANCE
TERMINATION
PACKAGING
VFC
1206
RESISTANCE
RANGE
LETTER
DESIGNATOR
MULTIPLIER
FACTOR
T
±
0.01%
Q
±
0.02%
A
±
0.05%
B
±
0.1%
C
±
0.25%
D
±
0.5%
F
±
1.0%
B
- solderable
T
= Tape and
Reel
W
= Waffle Pack
10
to <1K
R
x 1.0
Example: 249R00 = 249
1K to 30K
K
x 10
3
Example: 10K000 = 10.0K
TABLE 4 - ORDERING INFORMATION
Patent Pending
FIGURE 2 - POWER DERATING CURVE
Bulk Metal
Foil Technology
High Precision Flip Chip, Patent Pending
Z
G
X
Bottom View (Showing Terminals for Mounting):
FIGURE 4 - DIMENSIONS AND LAND PATTERN
in inches (millimeters)
CHIP
SIZE
L
W
THICKNESS
MAXIMUM
D
W1
Z
G
X
±
0.005 (0.13)
0.126
(3.20)
±
0.005 (0.13)
0.062
(1.57)
±
0.003 (0.08)
0.015
(0.38)
±
0.003 (0.08)
0.059
(1.50)
±
0.003 (0.08)
0.126
(3.20)
±
0.003 (0.08)
±
0.003 (0.08)
0.090
(2.29)
0.025
(0.64)
0.062
(1.57)
1206
Land Pattern
RESISTANCE
RANGE
(
)
10R - 30K
POWER
+ 70
°
C
(mW)
MAXIMUM
VOLTAGE
(V)
MAXIMUM
WEIGHT
(mg)
125
61
10.3
TABLE 3 - PROPERTIES
125
100
75
50
25
0
-75
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (
°
C)
P
–55
°
C
+70
°
C
Rated Power
W1
L - 0.003 (0.08)
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