參數(shù)資料
型號(hào): VEMT2000X01
廠商: VISHAY SEMICONDUCTORS
元件分類: 光敏三極管
英文描述: Phototransistor IR Chip Silicon 860nm 2-Pin SMD T/R
中文描述: Photodetector Transistors NPN Phototransistor
文件頁(yè)數(shù): 4/8頁(yè)
文件大小: 134K
代理商: VEMT2000X01
VEMT2000X01, VEMT2020X01
Vishay Semiconductors
www.vishay.com
Rev. 1.3, 23-Aug-11
4
Document Number: 81595
For technical questions, contact:
detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc91000
REFLOW SOLDER PROFILE
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: T
amb
< 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
PACKAGE DIMENSIONS VEMT2000X01
in millimeters
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Time (s)
T
240 °C
217 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19841
255 °C
21570
2.2
5.8
± 0.2
2
±
2.3
± 0.2
Collector
0
0
±
0
1.1
± 0.1
Emitter
PIN ID
0
2.2
0
0
1
0.4
1.8
± 0.1
2
±
specifications
Technical drawings
Not indicated to
lerances ±0.1
Drawing-No.: 6.544-5391.01-4
Issue: 1; 26.09.08
Exposed copper
0
6.7
1.7
2.3
± 0.1
Solder pad proposal
acc. IPC 7351
Z 20:1
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