參數(shù)資料
型號: VEMD2020X01
廠商: VISHAY SEMICONDUCTORS
元件分類: 光敏二極管
英文描述: Photodiode PIN Chip 940nm 2-Pin SMD T/R
中文描述: Photodiodes PIN Photo Diode
文件頁數(shù): 1/8頁
文件大?。?/td> 136K
代理商: VEMD2020X01
VEMD2000X01, VEMD2020X01
Vishay Semiconductors
www.vishay.com
Rev. 1.3, 23-Aug-11
1
Document Number: 81962
For technical questions, contact:
detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc91000
Silicon PIN Photodiode
DESCRIPTION
VEMD2000X01 and VEMD2020X01 are high speed and high
sensitive PIN photodiodes in a miniature surface mount
package (SMD) with dome lens and daylight blocking filter.
Filter is matched with IR emitters operating at wavelength of
830 nm to 950 nm. The photo sensitive area of the chip is
0.23 mm
2
.
FEATURES
Package type: surface mount
Package form: GW, RGW
Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8
AEC-Q101 qualified
High radiant sensitivity
Daylight blocking filter matched with 830 nm
to 950 nm IR emitters
Fast response times
Angle of half sensitivity:
= ± 15°
Package matched with IR emitter series
VSMB2000X01
Floor life: 4 weeks, MSL 2a, acc. J-STD-020
Lead (Pb)-free reflow soldering
Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
Note
**
Please see document “Vishay Material Category Policy”:
www.vishay.com/doc99902
APPLICATIONS
High speed photo detector
Infrared remote control
Infrared data transmission
Photo interrupters
Shaft encoders
Note
Test conditions see table “Basic Characteristics”
Note
MOQ: minimum order quantity
21568-1
VEMD2020X01
VEMD2000X01
PRODUCT SUMMARY
COMPONENT
VEMD2000X01
VEMD2020X01
I
ra
(μA)
12
12
(deg)
± 15
± 15
λ
0.5
(nm)
750 to 1050
750 to 1050
ORDERING INFORMATION
ORDERING CODE
VEMD2000X01
VEMD2020X01
PACKAGING
Tape and reel
Tape and reel
REMARKS
PACKAGE FORM
Reverse gullwing
Gullwing
MOQ: 6000 pcs, 6000 pcs/reel
MOQ: 6000 pcs, 6000 pcs/reel
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Reverse voltage
Power dissipation
T
amb
25 °C
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Acc. reflow solder profile fig. 7
Thermal resistance junction/ambient
Acc. J-STD-051
SYMBOL
V
R
P
V
T
j
T
amb
T
stg
T
sd
R
thJA
VALUE
60
215
100
- 40 to + 100
- 40 to + 100
260
250
UNIT
V
mW
°C
°C
°C
°C
K/W
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