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參數(shù)資料
| 型號(hào)： | V68MLA1206H |
| 英文描述： | DIODE SUPPRESS SMD BAUFORM 1206 68V |
| 中文描述： | 貼片二極管禁止BAUFORM 1206 68V |
| 文件頁(yè)數(shù)： | 12/12頁(yè) |
| 文件大?。?/td> | 87K |
| 代理商： | V68MLA1206H |
All Harris semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Harris semiconductor products are sold by description only. Harris Semiconductor Communications Division reserves the right to make changes in circuit design and/or
specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Harris
is believed to be accurate and reliable. However, no responsibility is assumed by Harris or its subsidiaries for its use; nor for any infringements of patents or other rights
of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Harris or its subsidiaries.
For information regarding Harris Semiconductor Communications Division and its products, call
1-800-4-HARRIS
or see web site
http://www.semi.harris.com
5-14
Tape and Reel Specifications
Conforms to EIA - 481, Revision A
Can be Supplied to IEC Publication 286 - 3
SYMBOL
DESCRIPTION
MILLIMETERS
A
0
Width of Cavity
Dependent on Chip Size to Minimize Rotation.
B
0
Length of Cavity
Dependent on Chip Size to Minimize Rotation.
K
0
Depth of Cavity
Dependent on Chip Size to Minimize Rotation.
W
Width of Tape
8
±
0.2
F
Distance Between Drive Hole Centers and Cavity Centers
3.5
±
0.5
E
Distance Between Drive Hole Centers and Tape Edge
1.75
±
0.1
P
1
Distance Between Cavity Center
4
±
0.1
P
2
Axial Distance Between Drive Hole Centers and Cavity Centers
2
±
0.1
P
0
Axial Distance Between Drive Hole Centers
4
±
0.1
D
0
Drive Hole Diameter
1.55
±
0.05
D
1
Diameter of Cavity Piercing
1.05
±
0.05
t
1
Embossed Tape Thickness
0.3 Max
t
2
Top Tape Thickness
0.1 Max
NOTE: Dimensions in millimeters.
K
0
t
1
t
2
D
0
P
0
D
1
P
1
A
0
P
2
B
0
F
E
W
PLASTIC CARRIER TAPE
EMBOSSMENT
TOP TAPE
M0
NOMINAL
PRODUCT
IDENTIFYING
LABEL
178mm
OR 330mm
DIA. REEL
ML Series
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| V18MLA1206H | DIODE SUPPRESS SMD BAUFORM 1206 18V |
| V18MLA1210H | DIODE SUPPRESS SMD BAUFORM 1210 18V |
| V26MLA1206H | DIODE SUPPRESS SMD BAUFORM 1206 26V |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| V68MLA1206H | 制造商:Littelfuse 功能描述:VARISTOR 1206 68VA |
| V68MLA1206H | 制造商:Littelfuse 功能描述:Metal Oxide Varistor (MOV) |
| V68MLA1206N | 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:Surface Mount Multilayer Varistors |
| V68MLA1206NA | 功能描述:壓敏電阻 68V 180A 100pF RoHS:否 制造商:EPCOS 產(chǎn)品:MLV 電壓額定值 DC:22 V 電壓額定值 AC:17 V 鉗位電壓:50 V 直徑: 峰值浪涌電流:30 A 浪涌能量額定值:75 mJ 電容:74.2 pF 工作溫度范圍:- 55 C to + 125 C 安裝:SMD/SMT 封裝:Reel |
| V68MLA1206NH | 功能描述:壓敏電阻 68V 180A 100pF RoHS:否 制造商:EPCOS 產(chǎn)品:MLV 電壓額定值 DC:22 V 電壓額定值 AC:17 V 鉗位電壓:50 V 直徑: 峰值浪涌電流:30 A 浪涌能量額定值:75 mJ 電容:74.2 pF 工作溫度范圍:- 55 C to + 125 C 安裝:SMD/SMT 封裝:Reel |
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