
Vicor Corporation Tel: 800-735-6200 vicorpower.com
VI Chip Voltage Transformation Module
Rev. 1.6
Page 6 of 20
4
5
PRELIMINARY
VI CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS
Specifications, continued
Symbol
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient
1
Junction-to-ambient
2
Min
125
Typ
130
0.61
1.1
2.1
6.5
5.0
Max
135
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Note
Junction temperature
R
θ
JC
R
θ
JB
R
θ
JA
R
θ
JA
THERMAL
Notes
1.V048K015T80 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
2.V048L015T80 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 4
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Highly Accelerated Life Testing (HALT)
Operation limits verified, destruct margin determined
Dynamic cycling
Per Vicor internal
test specification
Constant line, 0-100% load, -20°C to 125°C
Test
Standard
IPC-SM-785
IPC-9701
IPC-9701
IPC J-STD-029
IPC J-STD-029
Environment
TC3, -40 to 125°C at <10 °C/min,
10 min dwell time
BGA Daisy-Chain thermal cycling
Ball shear
No failure through intermetallic
Bend test
Deflection through 4 mm
VI CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION