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VI Chip Voltage Transformation Module
V048K096T025
Rev. 1.0
Page 5 of 15
PRELIMINARY
VI Chip Stress Driven Product Qualification Process
Symbol
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient
(1)
Junction-to-ambient
(2)
Min
125
Typ
130
0.61
1.1
2.1
6.5
5.0
Max
135
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Note
Junction temperature
R
θ
JC
R
θ
JB
R
θ
JA
R
θ
JA
Thermal
Notes:
(1) V048K096T025 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) V048K096T025 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification
(1)
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 5
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Highly Accelerated Life Testing (HALT)
Operation limits verified, destruct margin determined
Dynamic cycling
Per Vicor internal
test specification
(1)
Constant line, 0-100% load, -20°C to 125°C
Note:
(1) For details of the test protocols see Vicor’s website.
Test
Standard
IPC-9701
IPC-SM-785
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
BGA solder fatigue evaluation
Solder ball shear test
IPC-9701
Failure through bulk solder or copper pad lift-off
VI Chip Ball Grid Array Interconnect Qualification
Electrical Specifications
(continued)