參數(shù)資料
型號: V048K015T80
廠商: Vicor Corporation
元件分類: DC/DC變換器
英文描述: VI Chip - VTM Voltage Transformation Module
中文描述: 六芯片- VTM電壓轉(zhuǎn)換模塊
文件頁數(shù): 16/20頁
文件大?。?/td> 630K
代理商: V048K015T80
Vicor Corporation Tel: 800-735-6200 vicorpower.com
VI Chip Voltage Transformation Module
Rev. 1.6
Page 16 of 20
4
5
VI Chip Handling and Solderability
The product should remain in its package in a dry environment
until ready for use.
The following table shows the soldering requirements for both
the BGAin-board surface mount package and the J-lead
on-board surface mount package.
The reflow process should use industry standard Surface Mount
Technology (SMT) conditions. The exact conditions will
depend upon the solder paste manufacturer’s recommendations.
Under no circumstance should the case temperature exceed
208°C. Refer to Fig.32 for a suggested thermal profile.
Figure 32
—Thermal profile diagram
Application Note (continued)
PRELIMINARY
BGAPackage
63/37 "No Clean"*
4-6 mil
20 mil; 1:1 ratio
Within 50% of pad center
<500 in/sec
2
J-Lead Package
63/37 "No Clean"
4-6 mil
0.8-0.9:1 ratio
± 5 mil
<500 in/sec
2
Solder Paste
Stencil Thickness
Stencil Aperture
Placement
Acceleration Rate
*Halide free water washable 63/37 Flux paste can be used for the BGAversion
package only. Please consult our Application Engineers for further information.
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