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參數(shù)資料
| 型號： | V048F160T019 |
| 廠商： | Vicor Corporation |
| 元件分類： | DC/DC變換器 |
| 英文描述： | VI Chip - PRM-AL Pre-Regulator Module |
| 中文描述： | 六芯片-大羅馬尼亞黨鋁預(yù)穩(wěn)壓模塊 |
| 文件頁數(shù)： | 12/14頁 |
| 文件大小： | 416K |
| 代理商： | V048F160T019 |
vicorpower.com
800-735-6200
VI Chip Pre-Regulator Module
P048F048T24AL
Rev. 1.7
Page 12 of 14
PRELIMINARY
Configuration Options
VI Chip Pre-Regulator Module
Configuration
Standard
(1)
(Figure 21)
Standard with 0.25"
Heat Sink
(2)
Effective power density
875 W/in
3
437 W/in
3
Effective Junction-Board
thermal resistanc
2.4 °C/W
2.4 °C/W
Effective Junction-Case
thermal resistance
1.1 °C/W
N/A
Effective Junction-Ambient
thermal resistance 300LFM
6.8 °C/W
5.0 °C/W
Note:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
(2) Heat sink available as a separate item
STANDARD MOUNT
0.87
32.0
1.26
6.3
Figure 21
—Standard mounting – package F
mm
in
Figure 22
—Hole location for push pin heatsink relative to VIC
Symbol
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-board thermal impedance
Junction-to-ambient
(1)
Junction-to-ambient
(2)
Min
125
Typ
130
0.61
1.1
2.1
6.5
5.0
Max
135
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Note
Junction temperature
R
θ
JC
R
θ
JB
R
θ
JA
R
θ
JA
Thermal
Notes:
(1) P048F048T24AL surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) P048F048T24AL with a 0.25"H heatsink surface mounted on FR4 board, 300 LFM.
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