參數(shù)資料
型號(hào): V048F120M025
廠商: Vicor Corporation
元件分類(lèi): DC/DC變換器
英文描述: V?I ChipTM ? VTM Voltage Transformation Module
中文描述: 五?我ChipTM? VTM電壓轉(zhuǎn)換模塊
文件頁(yè)數(shù): 7/15頁(yè)
文件大?。?/td> 487K
代理商: V048F120M025
vicorpower.com
800-735-6200
VI Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 7 of 16
PRELIMINARY
NOTES:
1- DIMENSIONS ARE inch
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON TOP SURFACE
mm
30,00
1,00
0.039
0.591
18,00
0.709
1,00
0.039
9,00
0.354
1,00
0.039
1,00
0.039
I
O
L
L
C
C
BOTTOM VIEW
SOLDER BALL #A1
SEATING PLANE
TOP VIEW (COMPONENT SIDE)
O
I
SOLDER BALL
TYP
3,9
0.15
15,6
0.62
21,5
0.85
32,0
1.26
1,6
0.06
28,8
1.13
5,9
0.23
0.63
(106) X
0.51
0.020
SOLDER BALL
Mechanical Drawings
Figure 10
—VTM BGA mechanical outline; Inboard mounting
NOTES:
1- DIMENSIONS ARE inch
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
mm
15,00
0.591
17,00
0.669
20,00
13,00
0.512
16,00
0.630
24,00
0.945
8,00
0.315
16,16
0.636
8,08
0.318
18,00
0.709
1,00
9,00
0.354
0,37
0.015
29,26
1.152
(2) X 10,00
(4) X 6,00
1,00
0.039
PCB CUTOUT
+
+
-
+
-
-
V
T
P
SOLDER PAD #A1
RECOMMENDED LAND AND VIA PATTERN
(COMPONENT SIDE SHOWN)
SOLDER MASK
1,6
0,51
0.020
1,50
0,50
1,00
0.039
0,50
0.020
SOLDER MASK
CONNECT TO
(106) X
(4) X R
( 0.020
(0.039
0,53
(0.039
31
1
Figure 11
— VTM BGA PCB land/VIA layout information; Inboard mounting
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the VI Chip
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