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VI Chip Voltage Transformation Module
V048K096T025
Rev. 1.0
Page 1 of 15
PRELIMINARY
Product Description
The V048K096T025 VI Chip Voltage Transformation
Module (VTM) excels at speed, density and efficiency to
meet the demands of advanced DSP, FPGA, and ASIC at
the point of load (POL) while providing isolation from
input to output. It achieves a response time of less than
1 μs and delivers up to 25.0 A in a volume of less than
0.25 in
3
with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 5.20 to 11.0 Vdc.
The VTM V048K096T025’s nominal output voltage is
9.6 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 5.20 to 11.0 Vdc at no load, and from
4.95 to 10.8 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closed-
loop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/5 , for applications requiring a programmable
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation Module
(PRM) or DC-DC converter enables tight load regulation.
The 9.6 V VTM achieves a power density of 974 W/in
3
in
a VI Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
VI Chip BGA package supports in-board mounting with
a low profile of 0.16" (4 mm) over the board. A J-lead
package option supports on-board surface mounting
with a profile of only 0.25" (6 mm) over the board. The
VTM’s fast dynamic response and low noise eliminate the
need for bulk capacitance at the load, substantially
increasing the POL density while improving reliability and
decreasing cost.
Parameter
+In to -In
+In to -In
PC to -In
VC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 19.0
-0.1 to 16.0
2,250
25.0
37.5
270
405
208
-40 to 125
-55 to 125
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow
T - Grade
M - Grade
Operating junction temperature
(1)
Storage temperature
-40 to 150
-65 to 150
°C
°C
T - Grade
M - Grade
VI Chip
Voltage Transformation Module
TM
– VTM
48 V to 9.6 V VI Chip Converter
25.0 A (37.5 A for 1 ms)
High density – 974 W/in
3
Small footprint – 220 W/in
2
Low weight – 0.5 oz (14 g)
Pick & Place / SMD
125°C operation
1 μs transient response
3.5 million hours MTBF
Typical efficiency 96%
No output filtering required
Surface mount BGA or J-Lead
packages
V048K096T025
Actual size
VTM
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Output Current
Designator
(=I
OUT
)
V
048
K
096
T
025
Voltage
Transformation
Module
Input Voltage
Designator
Product Grade Temperatures (°C)
Grade
Storage
T
-40 to150
M
-65 to150
Operating
-40 to125
-55 to125
Configuration Options
F = On-board (Figure 15)
K = In-board (Figure 14)
Output Voltage
Designator
(=V
OUT
x10)
Part Numbering
Vf = 26- 55V
V
OUT
= 5.20- 11.0V
I
OUT
= 25.0A
K = 1/5
R
OUT
= 10.0m
max
Absolute Maximum Ratings