
17
UT22VP10 Radiation Hardened PAL
Radiation:
- = None
Lead Finish:
(A) =
(C)
=
(X) =
Solder
Gold
Optional
Screening:
(C) = Military Temperature
(P)
=
Prototype
Package Type:
(P)
=
(U) =
(W) =
24-pin DIP
24-pin Flatpack
28-pin Quad Flatpack
Device Type Modifier:
C-20 = CMOS I/O: 20ns propagation delay
C-25 = CMOS I/O: 25ns propagation delay
E-15 = CMOS I/O: 15.5ns propagation delay
E-20 = CMOS I/O: 20ns propagation delay
E-25 = CMOS I/O: 25ns propagation delay
T-15 = TTL I/O: 15.5ns propagation delay
T-20 = TTL I/O: 20ns propagation delay
T-25 = TTL I/O: 25ns propagation delay
UT22VP10 * * * * *
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold).
3. Military Temperature range flow per UTMC’s manufacturing flows document. Devices have 48 hours of burn-in and are tested at -55
°
C,
room temperature, and 125
°
C. Radiation characteristics are neither tested nor guaranteed and may not be specified.
4. Prototype flow per UTMC Manufacturing Flows Technical Description. Devices have prototype assembly and are tested at 25
°
C only.
Radiation is neither tested nor guaranteed.
5. (T-15, C-25, T-25, C-20, T-20) is V
DD
(min) = -0.009*(
o
C)+4.61.
6. (E-15, E-20 and E-25) is V
DD
(min) = -0.009*(
o
C)+4.41.
7. (E-15 and T-15) is tested at at -55
°
C, +25
°
C, and +50
°
C to 15.5ns for t
PD
. At +125
°
C tested to 20ns limit for t
PD
.