
RTI-21
4.0 O
PERATING
C
ONDITIONS
ABSOLUTE MAXIMUM RATINGS
1
(referenced to VSS)
Recommended Operating Conditions
BUS ARBITRATION
NAME
PIN NUMBER
LCC
47
TYPE
ACTIVE
DESCRIPTION
PGA
F11
DMARQ
TO
AH
Direct Memory Access Request. Active high
output requesting RTI access to memory.
Memory Clock (DMA Grant). Active low input
signaling the RTI that a memory access is
granted. Internal to the RTI, receipt of MEMCK
generates RAM chip select and RAM read/write
signals.
External Self-test Enable. Multi-function input
pin. In self-test mode forcing this pin high
allows the monitoring of self-test activity at the
bus stub. When the RTI is not in self-test this
pin defines the function of TALEN/PARITY.
External Self-test Channel Select. A/B Multi-
function input pin. In self-test mode forcing this
pin high selects the channel on which the self-
test is performed (Channel A = 1, Channel B =
0). When the RTI is not in self-test this pin
defines the function of TALEN/PARITY.
MEMCK
48
D11
TI
AL
EXT TST
29
L9
TDI
--
EXT TST CH SEL
A/B
31
K9
TUI
--
SYMBOL
PARAMETER
LIMITS
UNIT
V
DD
DC supply voltage
-0.3 to +7.0
V
V
IO
Voltage on any pin
-0.3 to V
DD
+0.3
V
I
I
DC input current
±
10
mA
T
STG
Storage temperature
-65 to +150
°
C
P
D
Maximum power dissipation
300
mW
T
J
Maximum junction temperature
+175
°
C
Θ
JC
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not
recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Thermal resistance, junction-to-case
20
°
C/W
SYMBOL
PARAMETER
LIMITS
UNIT
V
DD
DC supply voltage
4.5 to 5.5
V
V
IN
DC input voltage
0 to V
DD
V
T
C
Temperature range
-55 to +125
°
C
F
O
Operating frequency
12
±
.01%
MHz