參數(shù)資料
型號: USING
英文描述: Using the Expanded Memory Mode with the M16C/62
中文描述: 使用帶有擴展內(nèi)存雙隨機PWM模式
文件頁數(shù): 4/14頁
文件大?。?/td> 831K
代理商: USING
M16C/62
Other control signals used are the RDY and Hold signals. The RDY signal is used for any external device
that requires a long access time. The Hold signal is used to transfer the bus privileges from the CPU to
an external device.
Using the Expanded Memory Mode with the M16C/62
Note:
If the RDY and/or Hold signals are not used, they must be connected to Vcc or the CPU could be
permanently stuck in a wait state.
More detailed information on expanded memory, processor modes, and bus settings can be found in the
M16C/62 specification and user’s manual.
4. Using Expanded Memory with the PC4701 Emulation System
Some special considerations are required when using expanded memory with the PC4701 emulator. To
access any external memory with the emulator, the external memory area must first be mapped using the
emulator/debugger software PD30. When PD30 is first started, all memory except for the SFR area is
mapped as internal memory.
First, determine the external memory range that will be used according to the chip select that is being
used. This external memory area must be mapped to external. Open a script window in PD30 and use
the map command to change the memory range that is being used to "External". Command example:
“map 8000, 9000, ext”. This maps the memory range 8000h to 9000h as external memory. To check that
the changes have been set, type “map” in the command line and a list of the current memory map is
displayed.
There is one precaution to observe when using the emulator and the chip select two-memory space. The
memory addresses, 0FFFCh to 0FFFFh, are used by the emulator as a stack area. These addresses
must remain mapped as internal memory or the program will not reset properly. See the Emulation
System manual for more information on this precaution. Figure 3 shows an example of mapping the chip
select two-memory area around the emulator stack.
Figure 3. Mapping External Memory in PD30
AN-DECE-MCU-18-A
September 2001
3
相關(guān)PDF資料
PDF描述
USR931 9.3 VOLT ULTRA STABLE TEMPERATURE COMPENSATED ZENER REFERENCE DIODES
USR932 9.3 VOLT ULTRA STABLE TEMPERATURE COMPENSATED ZENER REFERENCE DIODES
USR933 9.3 VOLT ULTRA STABLE TEMPERATURE COMPENSATED ZENER REFERENCE DIODES
USV1A470MFH Aluminum Electrolytic Capacitor
USV0J101MFH Aluminum Electrolytic Capacitor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
USJ015PR3DXC05 功能描述:集管和線殼 USJ015PR3DXC30 = Strip RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector
USJ015PR3DXC15 功能描述:集管和線殼 USJ015PR3DXC15 = Strip RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector
USJ015PR3DXC2.5 功能描述:集管和線殼 USJ015PR3DXC2.5 = Strip RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector
USJ015PR3DXC30 功能描述:集管和線殼 USJ015PR3DXC60 = Strip RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector
USJ015PR3DXC60 功能描述:集管和線殼 USS004B4T=STRIP CON RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點類型:Pin (Male) 節(jié)距:1 mm 位置/觸點數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Brass 觸點電鍍:Gold 制造商:Hirose Connector