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參數(shù)資料
| 型號： | US1M-13-F |
| 廠商： | DIODES INC |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | 1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER |
| 中文描述： | 1 A, 1000 V, SILICON, SIGNAL DIODE |
| 封裝： | GREEN, PLASTIC, SMA, 2 PIN |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 399K |
| 代理商： | US1M-13-F |
e
3
DS16008 Rev. 7 - 2
1 of 3
US1A - US1M
www.diodes.com
Diodes Incorporated
US1A - US1M
1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
US1A
US1B
US1D
US1G
US1J
US1K
US1M
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
RMS Reverse Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Forward Voltage Drop
50
100
200
400
600
800
1000
V
35
70
140
280
1.0
420
560
700
V
A
@ T
T
= 75
°
C
I
FSM
30
A
@ I
F
= 1.0A
@ T
A
= 25
°
C
@ T
A
= 100
°
C
V
FM
1.0
1.3
5.0
100
1.7
V
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
Reverse Recovery Time (Note 2)
Typical Total Capacitance (Note 1)
Typical Thermal Resistance, Junction to Terminal
Operating and Storage Temperature Range
I
RM
m
A
t
rr
C
T
R
q
JT
T
j,
T
STG
50
20
75
10
ns
pF
°
C/W
°
C
30
-65 to +150
A
B
C
D
G
H
E
J
SMA
Min
Dim
A
B
C
D
E
G
H
J
All Dimensions in mm
Max
2.29
2.92
4.00
4.60
1.27
1.63
0.15
0.31
4.80
5.59
0.10
0.20
0.76
1.52
2.01
2.62
Features
Mechanical Data
·
Case: SMA
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Marking: Type Number & Date Code: See Page 3
Ordering Information: See Page 3
Weight: 0.064 grams (approximate)
·
·
·
·
·
·
·
Notes: 1. Measured with I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See figure 5.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pad as heat sink.
4. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see
EU Directive Annex Notes 5 and 7.
5. Short duration pulse test used to minimize self-heating effect.
Maximum Ratings and Electrical Characteristics
T
A
= 25
°
C unless otherwise specified
·
Glass Passivated Die Construction
Ultra-Fast Recovery Time for High Efficiency
Surge Overload Rating to 30A Peak
High Current Capability
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Compliant (Note 4)
·
·
·
·
·
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