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參數(shù)資料
| 型號： | UPS520 |
| 廠商： | MICROSEMI CORP-LOWELL |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | SCHOTTKY BARRIER RECTIFIER 0.5 AMP, 20 VOLT |
| 中文描述： | 0.5 A, 20 V, SILICON, SIGNAL DIODE |
| 封裝： | PLASTIC, SMT, POWERMITE-2 |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 197K |
| 代理商： | UPS520 |
Microsemi
Watertown Division
580 Pleasant Street Watertown, MA 02472 617-926-0404, Fax: 617-924-1235
Page 1
Copyright
2000
UPS520
.PDF
2001-09-13
W
M
.
C
UPS520
SCHOTTKY BARRIER RECTIFIER
0.5 AMP, 20 VOLT
W ATERTOW N DIVISION
DESCRIPTION
In Microsemi’s new Powermite SMT Package, these high efficiency Schottky
rectifiers offer power handling capabilities previously found only in much
larger packages. They are ideal for SMD applications that operate at high
frequencies.
In addition to its size advantages, Powermite package features include a full
metallic bottom that eliminates the possibility of solder flux entrapment during
assembly, and a unique locking tab acts as an integral heat sink. Its
innovative design makes this device ideal for use with automatic insertion
equipment
SURFACE MOU
NT
POWERMITE
Surface Mount Power Package
IMPORTANT:
For the most current data, consult
MICROSEMI
’s website:
http://www.microsemi.com
KEY FEATURES
Low Profile – Maximum
height of 1.1 mm
Footprint Area of 10 mm
2
Low V
F
Provides Higher
Efficiency
Low Thermal Resistance
with Direct Thermal Path
of Die on Exposed
Cathode Heat Sink
Supplied in 8mm Tape
and Reel –
3,000 units/7”
Reel; 12,000 units/13” Reel
APPLICATONS/BENEFITS
High power Surface Mount
Package
Guard Ring Protection
Low forward voltage
Integral Heat Sink/Locking Tabs
Compatible with Automatic
Insertion Equipment
Full Metallic Bottom Eliminates
Flux Entrapment
MECHANICAL CHARACTERISTICS
Case: Molded Epoxy
Meets UL94VO at 1/8 inch
Device Marking S52
Lead and Mounting Surface Temperature for
Soldering = 260°C Maximum
for 10 Seconds
U
P
S
5
2
0
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