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參數(shù)資料
| 型號： | UPP9401E3 |
| 廠商： | MICROSEMI CORP-SCOTTSDALE |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | POWERMITE TM PACKAGE COMMERCIAL TWO-WAY RADIO ANTENNA SWITCH DIODE |
| 中文描述： | SILICON, PIN DIODE |
| 封裝： | ROHS COMPLIANT, PLASTIC, DO-216, POWERMITE-2 |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 73K |
| 代理商： | UPP9401E3 |
POWERMITE
TM
PACKAGE COMMERCIAL
TWO-WAY RADIO ANTENNA SWITCH
DIODE
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright
2006
12-19-2006 REV B
W
M
.
C
SCOTTSDALE
DIVISION
UPP9401e3
U
DES CRIPT ION
APPEARANCE
This Microsemi Powermite PIN diode is perfect for two-way radio antenna
switch applications where size and power handling capability are critical with its
high isolation, low loss and low distortion characteristics. Its advantages also
include the low forward-bias resistance and high zero-bias impedance that are
essential for low loss, high isolation and wide bandwidth antenna switch
performance. It is an ideal selection for applications requiring low profile and
high-density mounting and is also available as RoHS Compliant with an e3
suffix. The Powermite package provides a full-metallic bottom that eliminates
the possibility of solder flux entrapment during assembly, and its unique locking
tab acts as an efficient heat path to the mounting surface. Its innovative design
makes this device ideal for use with automatic insertion equipment.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEAT URES
APPLICAT IONS / BENEFITS
High Power Surface Mount Package with very low
thermal resistance
RoHS compliant with e3 suffix part number
Specified Low Distortion
Low Bias Current Requirements
High Zero Bias Impedance
Full Metallic Bottom Eliminates Flux Entrapment
Integral Heat Sink/Locking Tabs
Two-way radio antenna switch
Low forward bias resistance
High zero bias resistance
Low loss high isolation for wide bandwidth
performance
Small size DO-216 package
Compatible with Automatic insertion Equipment
Very Low Inductance and Capacitance
MAX IMUM RATINGS
MECHANICAL AND PACK AGING
CASE: Void-free transfer molded thermosetting
epoxy compound meeting UL94V-0
TERMINALS: Annealed matteTin over copper and
readily solderable per MIL-STD-750, method 2026
POLARITY: Cathode designated by TAB 2
MARKING: P01
WEIGHT: 0.016 gram (approximate)
See package dimension on last page
Tape & Reel option: 16 mm tape per Standard EIA-
481-B, 3000 on 7 inch reel or 12,000 on 13 inch reel
Maximum Reverse Voltage: 50 Volts
Average Power Dissipation @ T
TAB1
=75
o
C: 2.5 Watts
(When mounted on a PC board with 2 oz copper.)
Thermal Resistance Junction to case (bottom): 10
o
C/W
Operating and Storage Temperature: -55
o
C to +150
o
C
Solder Temperatures: 260
o
C for 10 s (maximum)
ELECT RICAL CHARACT ERIS T ICS (
T
A
=
25
o
C
unless noted
)
Series
Resistance
R
S
, Ohms
f = 100 MHz
I
F
=50 mA
TYP
0.75
Capacitance
@ f = 100
MHz
V
R
= 0 V
C
T
pF
Parallel
Resistance
@ f = 100 MHz
V=0 V
R
P
Ohms
MIN
5K
Carrier
Lifetime
@ I
F
= 10 mA
τ
μ
S
MIN
1.0
Transmit
Harmonic
Distortion
@ Pin = 50 W
f = 50 MHz
I
F
= 50 mA
-dB
MIN
80
Receive 3
rd
Order Harmonic
Distortion
@ f = 100 MHz
V = 0 V
f
A
= 50 MHz
f
B
= 51 MHz
-dB
MIN
60
Voltage
Rating V
R
@ I
R
= 10
μ
A
Volts
MIN
50
Forward
Voltage V
F
@ I
F
= 50 mA
Volts
MAX
1.0
MAX
1.0
TYP
0.75
MAX
1.0
TYP
10K
TYP
2.0
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