參數(shù)資料
型號(hào)： UPD789122UC-XXX-5A4
元件分類： 微控制器/微處理器
英文描述： 8-BIT, MROM, MICROCONTROLLER, PDSO30
封裝： 0.300 INCH, SHRINK, PLASTIC, SOP-30
文件頁(yè)數(shù)： 42/54頁(yè)
文件大小： 481K
代理商： UPD789122UC-XXX-5A4
Data Sheet U13025EJ2V0DS00
45
PD789121, 789122, 789124, 789131, 789132, 789134
Table 13-1. Surface Mounting Type Soldering Conditions (2/2)
PD789121MC-xxx-5A4: 30-pin plastic shrink SOP (300 mils, resin thickness 1.2 mm)
PD789122MC-xxx-5A4: 30-pin plastic shrink SOP (300 mils, resin thickness 1.2 mm)
PD789124MC-xxx-5A4: 30-pin plastic shrink SOP (300 mils, resin thickness 1.2 mm)
PD789131MC-xxx-5A4: 30-pin plastic shrink SOP (300 mils, resin thickness 1.2 mm)
PD789132MC-xxx-5A4: 30-pin plastic shrink SOP (300 mils, resin thickness 1.2 mm)
PD789134MC-xxx-5A4: 30-pin plastic shrink SOP (300 mils, resin thickness 1.2 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher),
Count: three times or less
IR35-00-3
VPS
Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher),
Count: three times or less
VP15-00-3
Wave soldering
Solder bath temperature: 260°C Max., Time: 10 sec. Max., Count: once,
Preheating temperature: 120°C Max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)
–
Caution
Do not use different soldering methods together (except for partial heating).
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