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參數(shù)資料
| 型號： | UPD784224YGC |
| 廠商： | NEC Corp. |
| 英文描述： | 16/8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 16/8-BIT單晶片微控制器 |
| 文件頁數(shù)： | 84/92頁 |
| 文件大小： | 687K |
| 代理商： | UPD784224YGC |
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84
μ
PD784224, 784225, 784224Y, 784225Y
Data Sheet U12376EJ1V0DS00
16. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD784225 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Caution
Soldering conditions for the
μ
PD784224GC-
×××
-8BT,
μ
PD784225YGC-
×××
-8BT, and
μ
PD784225YGK-
×××
-9EU are undetermined because these products are under development.
Table 16-1. Soldering Conditions for Surface Mount Type
(1)
μ
PD784225GC-
×××
-8BT: 80-pin plastic QFP (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or
higher), Count: Two times or less, Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 20 hours)
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or
higher), Count: Two times or less, Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 20 hours)
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for 20 hours)
—
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
—
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD784224GK-
×××
-9EU: 80-pin plastic TQFP (fine pitch) (14
×
20 mm)
μ
PD784225GK-
×××
-9EU: 80-pin plastic TQFP (fine pitch) (14
×
20 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or
higher), Count: Two times or less, Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 20 hours)
IR35-103-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or
higher), Count: Two times or less, Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 20 hours)
VP15-103-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
—
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
—
Caution
Do not use different soldering methods together (except for partial heating).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD784225YGC | 16/8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD784225YGK | 16/8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD784225GC | 16/8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD784225GK | 16/8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD784224 | 16/8-BIT SINGLE-CHIP MICROCONTROLLERS |
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