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參數(shù)資料
| 型號： | UPD784218 |
| 廠商： | NEC Corp. |
| 英文描述： | 16-/8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 16-/8-bit的單晶片微控制器 |
| 文件頁數(shù)： | 83/92頁 |
| 文件大?。?/td> | 617K |
| 代理商： | UPD784218 |
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μ
PD784218, 784218Y
Data Sheet U12304EJ2V0DS00
83
17. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD784218 should be soldered and mounted under the following recommended conditions. For the details
of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting Technology
Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Caution
Soldering conditions for the
μ
PD784218YGC-
×××
-8EU and
μ
PD784218YGF-
×××
-3BA are undetermined
because these products are under development.
Table 17-1. Soldering Conditions for Surface Mount Type
(1)
μ
PD784218GC-
×××
-8EU: 100-pin plastic LQFP (Fine pitch) (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or
higher), Count: Two times or less, Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or
higher), Count: Two times or less, Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 10 hours)
VP-15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
—
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD784218GF-
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or
higher), Count: Two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or
higher), Count: Two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
—
Caution
Do not use different soldering methods together (except for partial heating).
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| UPD784976A | 16-Bit Single-Chip Microcontroller |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD784218AGC-382-8EU-NRE-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD784218AGC-382-8EU-SES-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD784935AGF-113-3BA | 制造商:NEC Electronics Corporation 功能描述: |
| UPD784938AGF-188-3BA | 制造商:NEC Electronics Corporation 功能描述: |
| UPD789104AMC(A)-968-5A4-E2 | 制造商:Renesas Electronics Corporation 功能描述: |
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