參數(shù)資料
型號(hào)： UPD78322L
廠商： NEC Corp.
英文描述： 16/8-BIT SINGLE-CHIP MICROCONTROLLER
中文描述： 16/8-BIT單片機(jī)
文件頁數(shù)： 78/88頁
文件大?。?/td> 479K
代理商： UPD78322L
78
μ
PD78320, 78322
11. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78322 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
“Semiconductor Device Mounting
Technology Manual” (IE-1207)
.
For soldering methods and conditions other than those recommended below, contact our salesman.
μ
PD78320GF-3B9
μ
PD78322GF-
×××
-3B9 : 80-pin plastic QFP (14
×
20 mm)
μ
PD78320GJ-5BJ
: 74-pin plastic QFP (20
×
20 mm)
μ
PD78322GJ-
×××
-5BJ : 74-pin plastic QFP (20
×
20 mm)
: 80-pin plastic QFP (14
×
20 mm)
Table 11-1. Soldering Conditions for Surface Mount Type
Soldering Method
Soldering Conditions
Package peak temperature: 235
°
C, Time: 30 sec. max. (at 210
°
C or above),
Number of times: twice or less
<Caution>
(1)
The second reflow should be started after the temperature of the device which
would have been changed by the first reflow has returned to normal.
(2)
Please avoid flux water washing after the first reflow.
Package peak temperature: 215
°
C, Time: 40 sec. max. (at 200
°
C or above),
Number of times: twice or less
<Caution>
(1)
The second reflow should be started after the temperature of the device which
would have been changed by the first reflow has returned to normal.
(2)
Please avoid flux water washing after the first reflow.
Solder bath temperature: 260
°
C max. Time: 10 sec. max., Number of times: Once
Preheating temperature: 120
°
C max. (package surface temperature)
Pin temperature: 300
°
C max. Time: 3 sec. max. (Per device side)
Recommended
Condition Symbol
IR35-00-2
VP15-00-2
WS60-00-1
Pin part heating
VPS
Wave soldering
Infrared reflow
μ
PD78320L
μ
PD78322L-
×××
: 68-pin plastic QFJ (
: 68-pin plastic QFJ (
950 mil)
950 mil)
Infrared reflow
Soldering Method
Recommended
Condition Symbol
IR30-00-1
VP15-00-1
Soldering Conditions
Package peak temperature: 230
°
C, Time: 30 sec. max. (at 210
°
C or above),
Number of times: Once
Package peak temperature: 215
°
C, Time: 40 sec. max. (at 200
°
C or above),
Number of times: Once
Pin part temperature: 300
°
C max. Time: 3 sec. max. (Per device side)
VPS
Pin part heating
Caution Use more than one soldering method should be avoided (except in the case of pin part heating).
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