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參數(shù)資料
| 型號： | UPD780232 |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash |
| 中文描述： | 8位微控制器與2/4/8K字節(jié)在系統(tǒng)可編程閃存 |
| 文件頁數(shù)： | 43/52頁 |
| 文件大?。?/td> | 345K |
| 代理商： | UPD780232 |
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43
μ
PD780232
Data Sheet U13415EJ2V0DS
13. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD780232 should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 13-1. Surface Mounting Type Soldering Conditions
μ
PD780232GC-
×××
-8BT: 80-pin plastic QFP (14
×
14)
Soldering
Soldering Conditions
Recommended Method
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or
higher), Count: Two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or
higher), Count: Two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
—
Caution
Do not use different soldering methods together (except for partial heating).
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