參數(shù)資料
型號(hào): UPD78014H
廠商: NEC Corp.
元件分類(lèi): 8位微控制器
英文描述: 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash
中文描述: 8位微控制器與2/4/8K字節(jié)在系統(tǒng)可編程閃存
文件頁(yè)數(shù): 52/66頁(yè)
文件大?。?/td> 565K
代理商: UPD78014H
μ
PD78F0034A, 78F0034AY
52
Data Sheet U14040EJ4V0DS
9. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78F0034A, 78F0034AY should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 9-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD78F0034AGC-8BS: 64-pin plastic LQFP (14
×
14)
μ
PD78F0034AYGC-8BS: 64-pin plastic LQFP (14
×
14)
μ
PD78F0034AGC-AB8: 64-pin plastic QFP (14
×
14)
μ
PD78F0034AYGC-AB8: 64-pin plastic QFP (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Caution Do not use different soldering methods together (except for partial heating).
(2)
μ
PD78F0034AGB-8EU: 64-pin plastic LQFP (10
×
10)
μ
PD78F0034AYGB-8EU: 64-pin plastic LQFP (10
×
10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
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