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參數(shù)資料
| 型號： | UPD78014 |
| 廠商： | NEC Corp. |
| 元件分類： | DC/DC變換器 |
| 英文描述： | 1 watt dc-dc converters |
| 中文描述： | 1瓦的DC - DC轉(zhuǎn)換器 |
| 文件頁數(shù)： | 56/62頁 |
| 文件大?。?/td> | 576K |
| 代理商： | UPD78014 |
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56
μ
PD78001B(A), 78002B(A)
14. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78001B(A)/78002B(A) should be soldered and mounted under the conditions recommended in the table
below.
For detail of recommended soldering conditions, refer to the information document
“Semiconductor Device
Mounting Technology Manual” (IEI-1207)
.
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 14-1 Surface Mounting Type Soldering Conditions
μ
PD78001BGC(A)-
×××
-AB8 :
μ
PD78002BGC(A)-
×××
-AB8 :
64-Pin Plastic QFP (
I
I
14 mm)
64-Pin Plastic QFP (
I
I
14 mm)
Table 14-2 Insertion Type Soldering Conditions
Caution
Wave soldering is only for the pins in order that jet solder can not contact with the chip
directly.
μ
PD78001BCW(A)-
×××
:
μ
PD78002BCW(A)-
×××
:
64-Pin Plastic Shrink DIP (750 mil)
64-Pin Plastic Shrink DIP (750 mil)
Infrared reflow
VPS
Pin part heating
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Twice max.
< Points to note >
(1) Start the second reflow after the device temprature by the first reflow returns to normal.
(2) Flux washing by the water after the first reflow should be avoided.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above)
Number of times: Twice max.
< Points to note >
(1) Start the second reflow after the device temprature by the first reflow returns to normal.
(2) Flux washing by the water after the first reflow should be avoided.
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per device side)
Recommended
Condition Symbol
IR35-00-2
VP15-00-2
—
Soldering Conditions
Soldering
Method
Caution
Use of more than one soldering method should be avoided (except in the case of pin part heating).
Soldering Method
Wave soldering
(Pin only)
Pin part heating
Soldering Conditions
Solder bath temperature: 260
°
C max., Duration: 10 sec. max.
Pin temperature: 300
°
C max., Duration: 3 sec. max. (per pin)
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