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參數(shù)資料
| 型號： | UPD780024ACW-xxx |
| 廠商： | NEC Corp. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:55; Series:JTP02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle |
| 中文描述： | 8位單晶片微控制器 |
| 文件頁數(shù)： | 83/96頁 |
| 文件大小： | 661K |
| 代理商： | UPD780024ACW-XXX |
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83
μ
PD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY
Data Sheet U14042EJ4V0DS
14. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
Table 14-1. Surface Mounting Type Soldering Conditions (1/3)
(1)
μ
PD780021AGC-
μ
PD780022AGC-
μ
PD780023AGC-
μ
PD780024AGC-
μ
PD780021AYGC-
μ
PD780022AYGC-
μ
PD780023AYGC-
μ
PD780024AYGC-
×××
-AB8: 64-pin plastic QFP (14 x 14)
×××
-AB8: 64-pin plastic QFP (14 x 14)
×××
-AB8: 64-pin plastic QFP (14 x 14)
×××
-AB8: 64-pin plastic QFP (14 x 14)
×××
-AB8: 64-pin plastic QFP (14 x 14)
×××
-AB8: 64-pin plastic QFP (14 x 14)
×××
-AB8: 64-pin plastic QFP
(14 x 14)
×××
-AB8: 64-pin plastic QFP (14 x 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
IR35-00-3
(at 210
°
C or higher), Count: Three times or less
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
VP15-00-3
(at 200
°
C or higher), Count: Three times or less
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
WS60-00-1
Count: Once, Preheating temperature: 120
°
C Max. (package surface
temperature)
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Caution Do not use different soldering methods together (except for partial heating).
(2)
μ
PD780021AGC-
μ
PD780022AGC-
μ
PD780023AGC-
μ
PD780024AGC-
μ
PD780021AYGC-
μ
PD780022AYGC-
μ
PD780023AYGC-
μ
PD780024AYGC-
×××
-8BS: 64-pin plastic LQFP (14 x 14)
×××
-8BS: 64-pin plastic LQFP (14 x 14)
×××
-8BS: 64-pin plastic LQFP (14 x 14)
×××
-8BS: 64-pin plastic LQFP (14 x 14)
×××
-8BS: 64-pin plastic LQFP (14 x 14)
×××
-8BS: 64-pin plastic LQFP (14 x 14)
×××
-8BS: 64-pin plastic LQFP
(14 x 14)
×××
-8BS: 64-pin plastic LQFP (14 x 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
IR35-00-2
(at 210
°
C or higher), Count: Two times or less
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
VP15-00-2
(at 200
°
C or higher), Count: Two times or less
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
WS60-00-1
Count: Once, Preheating temperature: 120
°
C Max. (package surface
temperature)
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Caution Do not use different soldering methods together (except for partial heating).
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