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參數(shù)資料
| 型號： | UPD780018AY |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash |
| 中文描述： | 8位微控制器與2/4/8K字節(jié)在系統(tǒng)可編程閃存 |
| 文件頁數(shù)： | 51/58頁 |
| 文件大?。?/td> | 552K |
| 代理商： | UPD780018AY |
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μ
PD78044H, 78045H, 78046H
51
12. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
μ
PD78044H,
μ
PD78045H, or
μ
PD78046H.
For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting
Technology Manual(C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 12-1 Soldering Conditions for Surface-Mount Devices
μ
PD78044HGF-
×××
-3B9: 80-pin plastic QFP (14
×
20 mm)
μ
PD78045HGF-
×××
-3B9: 80-pin plastic QFP (14
×
20 mm)
μ
PD78046HGF-
×××
-3B9: 80-pin plastic QFP (14
×
20 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering process
Soldering conditions
Recommended conditions
Infrared ray reflow
Peak package's surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 3
IR35-00-3
VPS
Peak package's surface temperature: 215
°
C
Reflow time: 40 seconds or less (200
°
C or more)
Maximum allowable number of reflow processes: 3
VP15-00-3
Wave soldering
Solder temperature: 260
°
C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
WS60-00-1
: 120
°
C max.
(measured on the package surface)
Partial heating method
Terminal temperature: 300
°
C or less
Heat time: 3 seconds or less (for one side of a device)
—
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