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參數(shù)資料
| 型號(hào)： | UPD7720AC |
| 廠商： | NEC Corp. |
| 英文描述： | QUARTERLY MICROPROCESSOR/MICROCOMPUTER RELIABILITY REPORT |
| 中文描述： | 季報(bào)微處理器/微機(jī)可靠性報(bào)告 |
| 文件頁(yè)數(shù)： | 4/12頁(yè) |
| 文件大?。?/td> | 59K |
| 代理商： | UPD7720AC |
NEC Electronics Inc.
Roseville Manufacturing
4
Table 1. Reliability Tests
The major reliability tests performed by NEC consist of high-temperature bias (HTB), 85°C/85% relative humidity (T/H),
high-temperature storage life (HTSL), and high-humidity storage life (HHSL) tests. Additionally, various environmental
and mechanical tests are performed. This table shows the conditions of the various life tests, environmental tests, and
mechanical tests.
Test Item
High-temperature bias
life
Symbol
HTB
MIL-STD 883C Method
1005
Condition
TA = 125
°
C,
VCC = 5.5 V.
TA = 150
°
C.
Remarks
Note 1
High-temperature storage
life
Temperature and
humidity life
HTSL
1008
Note 1
T/H
TA = 85
°
C,
RH = 85%.
VDD = 5.5 V, alternate
pin bias.
TA = 85
°
C,
RH = 85%.
TA = 125
°
C,
RH = 100%
P = 2.3 atm.
65
°
to 150
°
C, 1 hour/
cycle.
125g (DIP) 250g (QFP),
three bends, 90
°
, without
breaking.
TA = 230
°
C, 5 sec, rosin-
based flux.
260
°
C, 10 sec, rosin
based flux.
215
°
C VPS
235
°
C, IR reflow
10 cycles,
65
°
to 150
°
C.
15 cycles, 0
°
to 100
°
C.
Notes 1, 2
High-humidity storage
life
Pressure cooker
HHSL
Notes 1, 2
PCT
Notes 1, 2
Temperature cycle
T/C
1010
Note 1
Lead fatigue
LI
2004
Note 4
Solderability
SD
2003
Note 5
Soldering heat
TS
Note 3
DIP
PLCC
QFP
Temperature cycle
Thermal shock
1010
1011
Note 1
Notes:
1. Electrical test per data sheet is performed. Devices that exceed the data sheet limits are considered rejects.
2. Pretreatment as specified.
3. MIL-STD 750A, method 2031.
4. Broken lead is considered a reject.
5. Less than 95% coverage is considered a reject.
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