參數(shù)資料
型號: UPD754304GSA
廠商: NEC Corp.
元件分類: 4位微控制器
英文描述: 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
中文描述: 4位單片機(jī)的小型通用紅外遙控器
文件頁數(shù): 64/74頁
文件大小: 316K
代理商: UPD754304GSA
64
μ
PD754302, 754304, 754302(A), 754304(A)
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD754304 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 15-1. Surface Mounting Type Soldering Conditions
μ
PD754302GS-
×××
: 36-pin plastic shrink SOP (300 mil, 0.8-mm pitch)
μ
PD754304GS-
×××
: 36-pin plastic shrink SOP (300 mil, 0.8-mm pitch)
μ
PD754302GS(A)-
×××
: 36-pin plastic shrink SOP (300 mil, 0.8-mm pitch)
μ
PD754304GS(A)-
×××
: 36-pin plastic shrink SOP (300 mil, 0.8-mm pitch)
Soldering Method
Soldering Conditions
Symbol
Infrared rays reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Twice or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Twice or less
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or below, Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C MAX. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C or below, Time: 3 seconds max. (per pin row)
Caution
Do not use different soldering methods together (except for partial heating).
相關(guān)PDF資料
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UPD754302GS 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
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