- 您現(xiàn)在的位置：買賣IC網 > PDF目錄379502 > UPD753017AGK (NEC Corp.) 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER PDF資料下載
參數(shù)資料
| 型號： | UPD753017AGK |
| 廠商： | NEC Corp. |
| 元件分類： | 4位微控制器 |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| 中文描述： | 4位單片機的小型通用紅外遙控器 |
| 文件頁數(shù)： | 78/88頁 |
| 文件大小： | 438K |
| 代理商： | UPD753017AGK |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁當前第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁
78
μ
PD753012A, 753016A, 753017A
Data Sheet U11662EJ2V0DS00
Table 15-1. Soldering Conditions of Surface Mount Type (2/2)
(3)
μ
PD753012AGK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.05 mm)
μ
PD753016AGK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.05 mm)
μ
PD753017AGK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.05 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
(210
°
C or higher), Number of reflow processes: 3 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
(200
°
C or higher), Number of reflow processes: 3 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
Pin temperature: 300
°
C or below, Time: 3 seconds or below
(per side of device)
IR35-107-3
VPS
VP15-107-3
Partial heating
–
Note
The number of days for storage after the dry pack has been opened. The storage conditions are
25
°
C, 65% RH max.
(4)
μ
PD753012AGK-XXX-9EU: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.00 mm)
μ
PD753016AGK-XXX-9EU: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.00 mm)
μ
PD753017AGK-XXX-9EU: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.00 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
(210
°
C or higher), Number of reflow processes: 2 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
(200
°
C or higher), Number of reflow processes: 2 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
Pin temperature: 300
°
C or below, Time: 3 seconds or below
(per side of device)
IR35-107-2
VPS
VP15-107-2
Partial heating
–
Note
The number of days for storage after the dry pack has been opened. The storage conditions are
25
°
C, 65% RH max.
Caution Do not use two or more soldering methods in combination (except the partial heating method).
相關PDF資料 |
PDF描述 |
|---|---|
| UPD753016AGC | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD753012 | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD753016GC | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD753016GK | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD753017GK-XXX-BE9 | MICROCONTROLLER|4-BIT|UPD75XL CPU|CMOS|TQFP|80PIN|PLASTIC |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD75304GF-407-3B9 | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD75306G182 | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPD75308F478 | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPD75308G699 | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPD753204013 | 制造商:Panasonic Industrial Company 功能描述:IC |
發(fā)布緊急采購，3分鐘左右您將得到回復。