參數(shù)資料
型號(hào)： UPD753012GK
廠商： NEC Corp.
元件分類： 4位微控制器
英文描述： 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
中文描述： 4位單片機(jī)的小型通用紅外遙控器
文件頁(yè)數(shù)： 70/80頁(yè)
文件大?。?/td> 569K
代理商： UPD753012GK
70
μ
PD753012, 753016, 753017
14. RECOMMENDED SOLDERING CONDITIONS
Solder the
μ
PD753017 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document
Semiconductor
Device Mounting Technology Manual (C10535E)
.
For the soldering methods and conditions other than those recommended, consult NEC.
Table 14-1. Soldering Conditions of Surface Mount Type
(1)
μ
PD753012GC-XXX-3B9: 80-pin plastic QFP (14
×
14 mm)
μ
PD753016GC-XXX-3B9: 80-pin plastic QFP (14
×
14 mm)
μ
PD753017GC-XXX-3B9: 80-pin plastic QFP (14
×
14 mm)
Symbol of
Recommended
Condition
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 235 C, Time: 30 seconds max. (210 C min.),
Number of times: 3 max.
IR35-00-3
VPS
Package peak temperature: 215 C, Time: 40 seconds max. (200 C min.),
Number of times: 3 max.
VP15-00-3
Wave soldering
Solder bath temperature: 260 C max., Time: 10 seconds max.,
Number of times: 1
Preheating temperature: 120 C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 C max., Time: 3 seconds max. (per side of device)
–
Caution Do not use two or more soldering methods in combination (except partial heating).
相關(guān)PDF資料
PDF描述
UPD753016 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753017 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753017GC 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753017GK 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753016GK-XXX-BE9 MICROCONTROLLER|4-BIT|UPD75XL CPU|CMOS|TQFP|80PIN|PLASTIC
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