參數(shù)資料
型號(hào)： UPD753012A
廠商： NEC Corp.
元件分類： 4位微控制器
英文描述： 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
中文描述： 4位單片機(jī)的小型通用紅外遙控器
文件頁(yè)數(shù)： 78/88頁(yè)
文件大?。?/td> 438K
代理商： UPD753012A
78
μ
PD753012A, 753016A, 753017A
Data Sheet U11662EJ2V0DS00
Table 15-1. Soldering Conditions of Surface Mount Type (2/2)
(3)
μ
PD753012AGK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.05 mm)
μ
PD753016AGK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.05 mm)
μ
PD753017AGK-XXX-BE9: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.05 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
(210
°
C or higher), Number of reflow processes: 3 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
(200
°
C or higher), Number of reflow processes: 3 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
Pin temperature: 300
°
C or below, Time: 3 seconds or below
(per side of device)
IR35-107-3
VPS
VP15-107-3
Partial heating
–
Note
The number of days for storage after the dry pack has been opened. The storage conditions are
25
°
C, 65% RH max.
(4)
μ
PD753012AGK-XXX-9EU: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.00 mm)
μ
PD753016AGK-XXX-9EU: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.00 mm)
μ
PD753017AGK-XXX-9EU: 80-pin plastic TQFP (fine pitch) (12
×
12 mm, resin thickness 1.00 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
(210
°
C or higher), Number of reflow processes: 2 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
(200
°
C or higher), Number of reflow processes: 2 max., Exposure limit:
7 days
Note
(After that, prebaking is necessary at 125
°
C for 10 hours.)
Pin temperature: 300
°
C or below, Time: 3 seconds or below
(per side of device)
IR35-107-2
VPS
VP15-107-2
Partial heating
–
Note
The number of days for storage after the dry pack has been opened. The storage conditions are
25
°
C, 65% RH max.
Caution Do not use two or more soldering methods in combination (except the partial heating method).
相關(guān)PDF資料
PDF描述
UPD753016A 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753016AGK 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753012AGC 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753012AGK 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
UPD753017A 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER
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